Results 141 to 150 of about 3,178,541 (286)

From the Discovery of the Giant Magnetocaloric Effect to the Development of High‐Power‐Density Systems

Advanced Materials Technologies, EarlyView.
The article overviews past and current efforts on caloric materials and systems, highlighting the contributions of Ames National Laboratory to the field. Solid‐state caloric heat pumping is an innovative method that can be implemented in a wide range of cooling and heating applications.
Agata Czernuszewicz, Yaroslav Mudryk, Jun Cui, Lucas Griffith, Duane D. Johnson, Julie Slaughter   +5 more
wiley   +1 more source

Ultra‐White Elastomeric Coatings for Daytime Radiative Cooling

Advanced Materials Technologies, EarlyView.
Passive daytime radiative cooling meets elasticity in a new class of ultra‐white silicone coatings. Combining high solar reflectance with strong sky‐window emission, they hold surfaces below ambient temperature under full sunlight while remaining flexible and stretchable. This combination of cooling performance and mechanical flexibility enables energy‐
Abdulrahman Aljwirah, Xiaojie Liu, Khalid Alhammadi, Orlando G. Rivera Gonzalez, Won‐June Lee, Xiulin Ruan   +5 more
wiley   +1 more source

Effects of Short-Term Dietary Sodium Selenite Supplementation on Antioxidant Status, Heavy Metal Deposition, Flesh Quality and Flavor-Related Compounds of Common Carp (<i>Cyprinus carpio</i>), and a Potential Mechanism. [PDF]

Antioxidants (Basel)
Chen W, Kikoberwa S, Wu J, Xu P, Cheng H, Wen H.   +5 more
europepmc   +1 more source

Wet Deposition of Heavy Metals in an Arid City

Polish Journal of Environmental Studies, 2015
Yuyan Liu, Cheng Liu, Fangfang Tian
openaire   +1 more source

Hierarchically Wrinkled Silver Ink as a Platform for Fully Integrated Stretchable Electronic Systems

Advanced Materials Technologies, EarlyView.
Silver Hierarchical Responsive ink (SHRink), a universal approach for the fabrication of highly stretchable interconnects, wirings, and skin‐interfaced electrodes, is realized through low‐cost, scalable spray‐printing and transfer‐printing. The SHRink demonstrates high electrical conductivity (1.2E04 S cm−1) and large stretchability (235% max fracture ...
Junye Li, Hao Wang, Xinlei Chen, Mehmet Senel, Patrick Rwei, Sara Marmarchi, David Clymer, Blossom Sundarii Hak‐Khem, Nhi Nguyen, Chengyang Qian, Matt Thomson, Michelle Khine   +11 more
wiley   +1 more source

Two‐Step Thermal Upcycling of Flexible Printed Circuit Board Waste Into Metallic Copper Nanoparticles: Synthesis and Characterization

Advanced Materials Technologies, EarlyView.
A two‐step thermal upcycling process converts flexible printed circuit board waste into high‐purity copper nanoparticles using polymer degradation and arc discharge. The synthesized nanoparticles exhibit controlled morphology and high metal purity.
Bikesh S. Ghinangju, Rumana Hossain, Veena Sahajwalla   +2 more
wiley   +1 more source

Chitin‐Chitosan Cryogels for the Reversible Sequestration and Recovery of Heavy Metals From Wastewater

Advanced Materials Technologies, EarlyView.
Chitin‐chitosan cryogels with degrees of N‐acetylation from 12.2% to 71.4% are fabricated by dissolution, coagulation and lyophilization for the sequestration of heavy metals from water. Colorimetry and differential pulse voltammetry showed controlled adsorption and desorption capacities for As5+, Co2+ and Cu2+, making this material attractive for ...
Marta García‐Castrillo, Maialen Uribarrena, Jorge Sáiz, Guillermo Copello, Erlantz Lizundia   +4 more
wiley   +1 more source

Deposition of sediment and associated heavy metals on floodplains

, 2006
In recent years, floodplains have become widely acknowledged as important natural sinks for sediments and associated substances like nutrients, PAHs, PCBs and heavy metals. The character of floodplains will change in the near future because of landscaping measures (excavation of secondary channels, lowering floodplains and removing minor embankments ...
openaire   +2 more sources

Vertical Gate‐All‐Around SiGeSn/GeSn/SiGeSn Nanowire Transistors for Energy‐Efficient Electronics

Advanced Materials Technologies, EarlyView.
Band‐engineered SiGeSn/GeSn/SiGeSn heterostructures enable complementary vertical nanowire MOSFETs and steep slope tunnel FETs (TFETs) within a unified Group‐IV platform. Leakage suppression and tunnelling‐path engineering demonstrate an effective strategy for future low‐power and energy‐efficient integrated electronics.
Kenta Moto, Yannik Junk, Marvin Frauenrath, Florian Bärwolf, Jean‐Michel Hartmann, Andreas Mai, Detlev Grützmacher, Joachim Knoch, Dan Buca, Qing‐Tai Zhao   +9 more
wiley   +1 more source

Manganese Transport and Sediment Remobilization in a Tidal Estuary: Parameter Sensitivity and Uncertainty Analysis. [PDF]

Toxics
Liu HM, Liu WC, Huang WC, Young CC.
europepmc   +1 more source