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This article presents the NFDI‐MatWerk Ontology (MWO), a Basic Formal Ontology‐based framework for interoperable research data management in materials science and engineering (MSE). Covering consortium structures, research data management resources, services, and instruments, MWO enables semantic integration, Findable, Accessible, Interoperable, and ...
Hossein Beygi Nasrabadi +4 more
wiley +1 more source
High‐temperature interactions between low‐sulfur Al‐killed Mn–B steel and MgO–C refractories (0 and 50 wt% recyclates) are studied via finger immersion tests (1600 °C). Surface‐active elements influence infiltration. MgO/CaS layer forms, along with spinel and calcium silicate.
Matheus Roberto Bellé +5 more
wiley +1 more source
A numerical model resulting from irreversible thermodynamics for describing transport processes is introduced, focusing on thermodynamic activity gradients as the actual driving force for diffusion. Implemented in CUDA C++ and using CalPhaD methods for determining the necessary activity data, the model accurately simulates interdiffusion in aluminum ...
Ulrich Holländer +3 more
wiley +1 more source
Low‐cycle fatigue damage in Mn–Mo–Ni reactor pressure vessel steel is examined using a combined electron backscatter diffraction and positron annihilation lifetime spectroscopy approach. The study correlates texture evolution, dislocation substructure development, and vacancy‐type defect formation across uniform, necked, and fracture regions, providing
Apu Sarkar +2 more
wiley +1 more source
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Heterogeneous integration Roadmap
2017 International Conference on Electronics Packaging (ICEP), 2017This paper describes the background, purpose, mission, scope and schedule of the Heterogeneous Integration Roadmap. With the electronics industry entering an era of acceleration and disruption, the role of Heterogeneous Integration will prove very important in response to the driving forces of IoT, Data Centers, Smart Mobile and Intelligent Automotive.
William Chen, W.R Bottoms
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Chiplet Heterogeneous Integration
2021Recently, heterogeneous integration of chiplets (chiplet heterogeneous integration or heterogeneous chiplet integration) is getting lots of tractions [1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18]. Microprocessors such as AMD’s EPYZ and Intel’s Lakefield are in high volume manufacturing with chiplet designs and heterogeneous ...
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Heterogeneous Integration Techniques
Spatial Light Modulators and Intgrated Optoelectronic Arrays, 1999This paper briefly describes several methods of integrating optoelectronic devices onto silicon substrates.
D. L. Mathine, N. Peyghambarian
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Heterogeneous integration through electrokinetic migration
IEEE Engineering in Medicine and Biology Magazine, 2001We apply basic electrophoretic motion to semiconductor materials engineering for development of the next level of heterogeneous integration technology. Furthermore, we demonstrate the utility of these tools in integration of inorganic devices with biological species in order to explore the utility of these tools in biotechnological applications ...
M, Ozkan +5 more
openaire +2 more sources

