Results 221 to 230 of about 20,507 (308)

Nonmulberry Silk Fibroin Doping Boosts Charge Transfer and Charge Injection in Aligned Polypyrrole‐Silk Scaffolds for Low‐Voltage Neurostimulation

open access: yesAdvanced Materials Interfaces, EarlyView.
Conductive silk‐polypyrrole scaffolds couple redox stability with cell‐affinitive peptides present innately in an endogenous silk fibroin, enabling optimized electrical stimulation to drive neurite outgrowth. Findings establish electrochemical‐biological link for biomaterial design rules for smart nerve guidance conduits that can provide low voltage ...
Rajiv Borah   +5 more
wiley   +1 more source

Fabrication Method of Directional Microstructure for High Energy Density, High Power Battery Cathodes

open access: yesAdvanced Materials Interfaces, EarlyView.
Aqueous directional ice templating (DIT) is developed for making NMC811 cathodes containing vertically aligned pore arrays through electrode thickness. The effects of calendering are studied for the DIT electrodes to find optimal calendering and simultaneously achieve high gravimetric and volumetric energy densities and rate capability for lithium ion ...
Guanting Li   +3 more
wiley   +1 more source

From the Discovery of the Giant Magnetocaloric Effect to the Development of High‐Power‐Density Systems

open access: yesAdvanced Materials Technologies, EarlyView.
The article overviews past and current efforts on caloric materials and systems, highlighting the contributions of Ames National Laboratory to the field. Solid‐state caloric heat pumping is an innovative method that can be implemented in a wide range of cooling and heating applications.
Agata Czernuszewicz   +5 more
wiley   +1 more source

Extension of pole differential current based relaying for bipolar LCC HVDC lines. [PDF]

open access: yesSci Rep
Tiwari RS   +3 more
europepmc   +1 more source

Advanced Techniques for Scalable Woven E‐Textiles Manufacturing

open access: yesAdvanced Materials Technologies, EarlyView.
This review highlights recent advances in scalable weaving techniques for e‐textiles, emphasizing innovations in multilayer structures, conductive yarn integration, and loom modifications. It summarizes emerging materials, fabrication strategies, and performance considerations that enable reliable, durable, and industrially scalable woven electronic ...
Faisal Abedin   +2 more
wiley   +1 more source

Advancements in TLP Bonding for Power Electronics Die‐Attach Applications

open access: yesAdvanced Materials Technologies, EarlyView.
Transient Liquid Phase (TLP) bonding is gaining traction as a lead‐free die‐attach technology in power electronics packaging. This review examines the state of TLP bonding, its key elements, reliability aspects, and practical limitations. This review also highlights emerging trends, such as nanostructured interfaces, that may improve scalability of TLP
Fatin Battal   +4 more
wiley   +1 more source

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