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High-aspect-ratio bulk micromachining of titanium
Nature Materials, 2004Recent process developments have permitted the highly anisotropic bulk micromachining of titanium microelectromechanical systems (MEMS). By using the metal anisotropic reactive ion etching with oxidation (MARIO) process, arbitrarily high-aspect-ratio structures with straight sidewalls and micrometre-scale features have been bulk micromachined into ...
Marco F, Aimi +4 more
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A high aspect-ratio holey metalens
Conference on Lasers and Electro-Optics, 2021We design and fabricate metalenses comprising substrateless ultra-deep via-holes in silicon with aspect ratios exceeding 30:1. Deep holes allow us to circumvent fabrication and fragility constraints which limit the aspect ratios of free-standing meta-atoms.
Soon Wei Daniel Lim +2 more
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2017
The development of silicon microcomponents and microsystems, being an outgrowth of the processing techniques commonly used for the fabrication of integrated circuits, was constrained to mostly planar dimensions. This was because optical lithography and most photoresists were developed for this specific purpose.
Friedrich, C. R. +13 more
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The development of silicon microcomponents and microsystems, being an outgrowth of the processing techniques commonly used for the fabrication of integrated circuits, was constrained to mostly planar dimensions. This was because optical lithography and most photoresists were developed for this specific purpose.
Friedrich, C. R. +13 more
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High-Aspect Ratio Nanofabrication by Femtosecond Irradiation
2005 Pacific Rim Conference on Lasers & Electro-Optics, 2006We report on three-dimensional (3D) recording of the high-aspect ratio (far = 18) structures by holographic exposure using femtosecond pulses in a SU8 resist. Thickness of free standing planes was approximately 100 nm.
Juodkazis, Saulius +2 more
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Experimental high precision profilometry of high aspect ratio samples
SMC'98 Conference Proceedings. 1998 IEEE International Conference on Systems, Man, and Cybernetics (Cat. No.98CH36218), 2002Topographic features on the surface of samples can be imaged by using a wide variety of profilometry methods. Scanning Probe Microscopy (SPM) comprises a group of profilometry methods that are often used for high precision, nano-scale, short range 3-D imaging.
Bernardo Dantas Aumond +1 more
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High Aspect Ratio Plasmonic Nanostructures for Sensing Applications
ACS Nano, 2011We present an experimental and theoretical study of plasmonic modes in high aspect ratio nanostructures in the visible wavelength region and demonstrate their high performance for sensing applications. Ordered and well-defined plasmonic structures with various cross-sectional profiles and heights are obtained using a top-down fabrication process.
Päivänranta, Birgit +9 more
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Aeroacoustics of a High Aspect-Ratio Jet
9th AIAA/CEAS Aeroacoustics Conference and Exhibit, 2003Circulation control wings are a type of pneumatic high-lift device that have been extensively researched as to their aerodynamic benefits. However, there has been little research into the possible airframe noise reduction benefits of a circulation control wing.
Scott Munro, Krishan Ahuja
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Fabrication of Ultrasmooth, High-Aspect Ratio Nanostructures
ACS Applied Materials & InterfacesDeterministic and versatile approaches to sample preparation on nanoscopic scales are important in many fields including photonics, electronics, biology and material science. However, challenges exist in meeting many nanostructuring demands─particularly in emerging optical materials and component architectures.
John A. Scott +8 more
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Integration of High Aspect Ratio Structures
ECS Meeting Abstracts, 2006Abstract not Available.
Gurtej Sandhu, F. Gonzalez
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Fabrication of high-aspect-ratio lightpipes
Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena, 2011The authors report the development of two fabrication processes for creating high-aspect-ratio lightpipes in a 10 μm thick SiO2 layer, with smooth, uniform, and straight vertical sidewalls. Both processes require only standard optical lithography, without the need for advanced electron beam or deep-UV lithography.
Winnie N. Ye +3 more
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