Results 111 to 120 of about 1,161,743 (330)
Herein, the electroplating of titanium from an organic solvent, ethaline, is shown. Polymer additives are shown to smooth the roughness of the film, and small molecule additives are shown to produce a near‐mirror finish to the deposited metal. Titanium electroreduction is desired for a variety of medical, electronic, and bonding applications but has ...
Steven Livers+7 more
wiley +1 more source
Equal channel angular pressing of commercial pure copper under low strain amplitude (≈0.48) induces concurrent continuous and localized discontinuous dynamic recrystallization, forming a duplex structure influenced by strain heterogeneity and recovery. Moderate hardening after 4–12 passes results from progressive high‐angle grain boundary formation via
Paula Cibely Alves Flausino+6 more
wiley +1 more source
PODIO: An Event-Data-Model Toolkit for High Energy Physics Experiments [PDF]
Frank Gaede, B. Hegner, Pere Mato
openalex +1 more source
A machine learning‐driven framework is introduced to optimize 3D‐printable microneedles for enhanced tissue anchoring and reduced insertion damage. The optimized design achieves a 6.0‐fold improvement in pull‐out‐to‐penetration energy ratio over conventional shapes.
Jegyeong Ryu+5 more
wiley +1 more source
Innovative microelectronic technologies for high-energy physics experiments [PDF]
V. Borshchov
openalex +1 more source
Results from the first use of microstrip gas chambers in a high-energy physics experiment
F. Angelini+7 more
semanticscholar +1 more source
Microcellular Poly (Ethylene‐Co‐Vinyl Acetate)/Lignin Nanocomposites for Soft Ferroelectrets
Lignin valorization for advanced porous polymer nanocomposites development and an upscaling route for continuous manufacturing of soft ferroelectrets for energy harvesting are studied. This work examines the role of lignin and carbon nanotubes (CNT) in modifying the mechanical, dielectric, and ferroelectret properties of poly (ethylene‐co‐vinyl acetate)
Yuchen Lian+5 more
wiley +1 more source
Real‐time imaging and energy‐dispersive diffraction during solidification of Sn‐Bi alloy interconnect for electronic packaging applications are studied. Sn‐Bi solder alloys have generated significant interest in recent times due to their potential use in electronic packaging.
Amey Luktuke+3 more
wiley +1 more source
Experiment and Theory in High Energy Physics [PDF]
openaire +2 more sources