Results 171 to 180 of about 404,474 (337)

Ultra‐Fast Non‐Volatile Resistive Switching Devices with Over 512 Distinct and Stable Levels for Memory and Neuromorphic Computing

Advanced Functional Materials, EarlyView.
A materials and device design concept that comprises a self‐assembled ultra‐thin epitaxial ion‐transporting layer, an amorphous oxide overcoat oxygen‐blocking layer, and a partial filament formed during an electroforming step is proposed for low‐current multilevel resistive switching devices.
Ming Xiao, Markus Hellenbrand, Nives Strkalj, Babak Bakhit, Zhuotong Sun, Nikolaos Barmpatsalos, Dovydas Joksas, Hongyi Dou, Zedong Hu, Ping Lu, Samip Karki, Sundar Kunwar, Jonathan D. Major, Aiping Chen, Haiyan Wang, Quanxi Jia, Adnan Mehonic, Judith L. MacManus‐Driscoll   +17 more
wiley   +1 more source

Shock compression response of high entropy alloys [PDF]

, 2016
Zhen Jiang, Junyang He, Hao Wang, Husheng Zhang, Zhaoping Lü, L.H. Dai   +5 more
openalex   +1 more source

Versatile Selective Soldering via Molten Metal Printing for Heat‐Sensitive 3D Electronics and Smart Wearables

Advanced Functional Materials, EarlyView.
Selective soldering via molten metal printing enables component integration, even in heat‐sensitive applications across fields like additive manufacturing, sustainable electronics, and smart textiles. This method overcomes the temperature limitations of existing technologies.
Dániel Straubinger, Peter Koltay, Roland Zengerle, Sabrina Kartmann, Zhe Shu   +4 more
wiley   +1 more source

Print‐and‐Plate Architected Electrodes for Electrochemical Transformations Under Flow

Advanced Functional Materials, EarlyView.
Typical flow cell electrodes are composed of stochastic porous carbon, limiting understanding of electrode structure‐performance relationships. This work describes an approach, termed “print‐and‐plate,” to prepare porous electrodes by direct ink writing followed by conformal metal coating.
Dylan M. Barber, Sofía Edgar, Michael S. Emanuel, Michael D. Nelwood, Bok Yeop Ahn, Benito Román‐Manso, Thomas Cochard, Justin Platero, Kiana Amini, Chris H. Rycroft, Shmuel Rubinstein, Michael J. Aziz, Jennifer A. Lewis   +12 more
wiley   +1 more source

Research Progress on the Hydrogen Embrittlement Resistance Performance of High-Entropy Alloys. [PDF]

Materials (Basel)
Kong X, Jiang H, Lv Y, Xie W, Lu S, Xu D.   +5 more
europepmc   +1 more source

Solid-Solution CrCoCuFeNi High-Entropy Alloy Thin Films Synthesized by Sputter Deposition

, 2015
Zhinan An, Haoling Jia, Yueying Wu, Philip D. Rack, A. D. Patchen, Yuzi Liu, Yang Ren, Nan Li, Peter K. Liaw   +8 more
openalex   +1 more source

Superconductivity of Ta₃₄Nb₃₃Hf₈Zr₁₄Ti₁₁ high entropy alloy from first principles calculations [PDF]

, 2016
K. Jasiewicz, Bartłomiej Wiendlocha, P. Korbeń, S. Kaprzyk, J. Toboła   +4 more
openalex   +1 more source

Harnessing Outer Space for Improved Electrocaloric Cooling

Advanced Functional Materials, EarlyView.
A novel radiative heat sink/source‐integrated electrocaloric (R‐iEC) system combines the electrocaloric (EC) effect with a thermally conductive radiative cooler (TCRC) to address heat dissipation limitations in EC devices. Utilizing outer space as a heat sink, the system achieves up to 240 W m−2 of heat dissipation performance, making it highly ...
Dong Hyun Seo, Hyung Rae Kim, Joo Ho Yun, Hyunkyu Kwak, Do Hyeon Kim, Se‐Yeon Heo, Rujun Ma, Gil Ju Lee, Young Min Song   +8 more
wiley   +1 more source

Atomic Interaction-Based Prediction of Phase Formations in High-Entropy Alloys. [PDF]

ACS Omega
Islam MT, Giles SA, Sengupta D, Rajan K, Broderick SR.   +4 more
europepmc   +1 more source

Nitriding of a high entropy FeNiMnAlCr alloy

, 2015
Fanling Meng, Ian Baker
openalex   +2 more sources