Results 191 to 200 of about 555,829 (322)

Silicon‐Integrated Next‐Generation Plasmonic Devices for Energy‐Efficient Semiconductor Applications

open access: yesAdvanced Materials Technologies, EarlyView.
Silicon (Si)‐integrated plasmonics offer a pathway to next‐generation, energy‐efficient semiconductor applications. This review highlights advances using complementary metal–oxide–semiconductor (CMOS)‐compatible materials like transparent conductive oxides and novel architectures, particularly coupled hybrid plasmonic waveguides (CHPWs).
Nasir Alfaraj, Amr S. Helmy
wiley   +1 more source

Diamond 2D/3D Printing Technology: Bringing Scintillating Performance to Functional Materials and Their Applications

open access: yesAdvanced Materials Technologies, EarlyView.
This review highlights advances in printing with nano‐ and microparticulate diamond for applications such as sensors, thermal management, machining tools, and biointerfaces. By covering screen, inkjet, microcontact, and 3D printing techniques, it outlines how diamond particles can be integrated into composite materials and functional devices, while ...
Simona Baluchová   +1 more
wiley   +1 more source

Controlled Air Gap Formation between W and TiO2 Films via Sub‐Surface TiO2 Atomic Layer Etching

open access: yesAdvanced Materials Technologies, EarlyView.
Delivering SiH4 and WF6 to a lined array of TiO2 films produces a thin film of tungsten while simultaneously, the underlying TiO2 is removed. When the W‐coated TiO2 structure is exposed to further etching cycles after deposition, TiO2 etching continues vertically and laterally, creating a self‐supported W structure and a vacant air gap.
Hannah R. M. Margavio   +6 more
wiley   +1 more source

Spinodal decomposition enables coherent plasmonic metal/semiconductor heterostructure for full spectrum photocatalysis. [PDF]

open access: yesNat Commun
Lu L   +13 more
europepmc   +1 more source

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