Results 151 to 160 of about 180,427 (310)

Hot Forging of DIN 8555 E6-UM-60 Alloy Produced by Directed Energy Deposition: Understanding the Metallurgical Effects. [PDF]

Materials (Basel)
Ferreira CA, Schaeffer L, Daleffe A, Casagrande HC, de March G, da Silva JV.   +5 more
europepmc   +1 more source

A Microfiber‐Reinforced Janus Hydrogel E‐Skin With Recyclable Feature for Multimodal Sensing and Gender‐Specific Physiological Monitoring

Advanced Science, EarlyView.
Hydrogel‐based wearable electronics hold great promise for physiological monitoring in privacy‐sensitive regions. In this study, a polyurethane (PU) microfiber‐reinforced gelatin hydrogel e‐skin is developed, boasting multiple advantages such as ultra‐thinness, high toughness, and long‐term skin conformability.
Yarong Ding, Yufeng Li, Shaozhe Tan, Jiachun Sun, Xu Yang, Xuesi Zhang, Zhenhua Lin, Zhenyu Li, Yue Hao, Yannan Liu, Yingchun Li, Jingjing Chang   +11 more
wiley   +1 more source

Selective Deposition of Charged Droplets for Programmable and Rewritable Printing of Patterned Microstructure Arrays

Advanced Science, EarlyView.
A residual‐charge‐induced electric field control (SDREC) strategy enables the fabrication of patterned microstructure arrays with a resolution of 20 µm via the selective deposition of charged droplets. The resulting arrays exhibit reversible writing/erasing, optical encryption, and selective silver electrode formation, offering a versatile route to ...
Yuechen Pei, Li Wang, Zhaofa Zhang, Yulin Zheng, Tianxue Yin, Jiaye Chen, Juntao Zhang, Yujie Qi, Bingheng Lu   +8 more
wiley   +1 more source

Clinical study on closed Kirschner wire prying reduction for Gartland Type IV supracondylar humeral fractures in children and analysis of typical cases. [PDF]

Front Surg
Wu Y, Wen J, Hui W, Wang J, Yang F, Qiu X, Peng Y, Yuan Z.   +7 more
europepmc   +1 more source

Thermal conductivity of diamond-loaded glues for the ATLAS particle physics detector

, 2010
The ATLAS experiment is one of two large general-purpose particle detectors at the Large Hadron Collider (LHC) at the CERN laboratory in Geneva, Switzerland.
Harris, A., Ouellette, E. A.
core  

A Reliable Strategy to Unravel the Structure and Composition of Semiconducting Conjugated Donor‐Acceptor Block Copolymers

Advanced Science, EarlyView.
This work proposes a reliable strategy to elucidate the structure and composition of conjugated donor‐acceptor block copolymers. The method, based on NMR analysis, allows to extract key structural information such as the number of heterojunctions (NoH) and the number of blocks (NoB) of the copolymers.
Antoine Curé, Pierre‐Alain Bayle, Lucie Rivet, Yann Kervella, Renaud Demadrille, Cyril Aumaître   +5 more
wiley   +1 more source

Marsupialisation of a tunnel flap for a false oesophageal lumen post peroral endoscopic myotomy. [PDF]

Endoscopy
Ahmadzai H, Kerrison C, Kim JY, Lam B, Kim YS, Gupta S, Bourke MJ.   +6 more
europepmc   +1 more source

Multimodal Wearable Biosensing Meets Multidomain AI: A Pathway to Decentralized Healthcare

Advanced Science, EarlyView.
Multimodal biosensing meets multidomain AI. Wearable biosensors capture complementary biochemical and physiological signals, while cross‐device, population‐aware learning aligns noisy, heterogeneous streams. This Review distills key sensing modalities, fusion and calibration strategies, and privacy‐preserving deployment pathways that transform ...
Chenshu Liu, Haolin Fan, Minwoo Kim, Tong Zhou, Pinyi Yang, Lingdi Zhao, Yiran Wang, Ziyuan Che, Chia‐Wei Liu, Bingbing Li, Yangzhi Zhu   +10 more
wiley   +1 more source

Endoscopic ultrasound-guided gastroenterostomy with lumen-apposing metal stent: an animal study comparison of wireless and over-the-wire techniques. [PDF]

Sci Rep
Monino L, Gonzalez JM, Evrard R, Bonaccorsi E, Baldin P, Deprez PH, Barthet M, Moreels TG.   +7 more
europepmc   +1 more source

Emerging Advanced Electronic Packaging Materials for Thermal Management in Power Electronics

Advanced Science, EarlyView.
This review surveys emerging materials for thermal management in advanced electronic packaging, with emphasis on ceramic substrates and thermal interface materials. Multiscale simulations and mechanistic analyses are highlighted, alongside the emerging role of artificial intelligence in predicting thermal properties and guiding design, offering ...
Yongjun Huo, Jiaqi Song, Wenqian Li, Jian Zhang, Yujin Zhang, Yang Fu, Wangchao Yuan, Xin Chen, Sichen Liu, Miao Jiang, Yuan Cheng, Gang Zhang   +11 more
wiley   +1 more source