Results 101 to 110 of about 2,212 (179)

Low parasitic inductance multi-chip SiC devices packaging technology [PDF]

open access: yes
This paper presents a novel packaging structure which employs stacked substrate and flexible printed circuit board (PCB) to obtain very low parasitic inductance and hence feature high switching speed SiC power devices.
Castellazzi, Alberto   +4 more
core  

Hybrid quasi-3D optimization of grid architecture for single junction photovoltaic converters. [PDF]

open access: yesOpt Quantum Electron, 2021
Nikander V   +5 more
europepmc   +1 more source

Home - About - Disclaimer - Privacy