Results 151 to 160 of about 71,965 (195)
Studies on HeLa cell nuclear DNA-like RNA by RNA-DNA hybridization. [PDF]
H.C. Birnboim+2 more
openalex +1 more source
A novel stratum corneum‐inspired zwitterionic hydrogel is developed for intelligent, flexible sensors, featuring intrinsic water retention and anti‐freezing properties. The quasi‐gel, composed of hygroscopic polymers and bound water, maintains its softness across a wide range of humidity.
Meng Wu+8 more
wiley +1 more source
MOLECULAR HYBRIDIZATION OF RADIOACTIVE DNA TO THE DNA OF CYTOLOGICAL PREPARATIONS
Mary Lou Pardue, Joseph G. Gall
openalex +1 more source
A lack of standard approaches for testing and reporting the performance of metal halide perovskites and organic semiconductor radiation detectors has resulted in inconsistent interpretation of performance parameters, impeding progress in the field. This Perspective recommends key metrics and experimental details, which are suggested for reporting in ...
Jessie A. Posar+8 more
wiley +1 more source
Photoswitchable Conductive Metal–Organic Frameworks
A conductive material where the conductivity can be modulated remotely by irradiation with light is presented. It is based on films of conductive metal–organic framework type Cu3(HHTP)2 with embedded photochromic molecules such as azobenzene, diarylethene, spiropyran, and hexaarylbiimidazole in the pores.
Yidong Liu+5 more
wiley +1 more source
The separation of Helium gas from natural gas is challenging but highly important. MIL‐116(Ga), a “non‐porous” metal–organic framework is used as a molecular sieve to separate He from CH4. Druse‐like MIL‐116(Ga) particles are integrated into polysulfone mixed matrix membranes.
Ayisha Komal+10 more
wiley +1 more source
Carbon Nanotube 3D Integrated Circuits: From Design to Applications
As Moore's law approaches its physical limits, carbon nanotube (CNT) 3D integrated circuits (ICs) emerge as a promising alternative due to the miniaturization, high mobility, and low power consumption. CNT 3D ICs in optoelectronics, memory, and monolithic ICs are reviewed while addressing challenges in fabrication, design, and integration.
Han‐Yang Liu+3 more
wiley +1 more source