Results 111 to 120 of about 362,117 (167)

Plasmodium berghei High-Throughput (PbHiT): a CRISPR-Cas9 System to Study Genes at Scale. [PDF]

Bio Protoc
Jonsdottir TK, Paoletta MS, Henriksson J, Bushell ESC.   +3 more
europepmc   +1 more source

Hydrogel Systems in Plant Germplasm Cryopreservation: A Comprehensive Review. [PDF]

Gels
Bobrova O, Husak V, Bilavcik A, Faltus M.   +3 more
europepmc   +1 more source

Water Versus Land on Temperate Rocky Planets. [PDF]

Space Sci Rev
Guimond CM, Spohn T, Berdyugina S, Byrne PK, Coltice N, Glaser DM, Lingam M, Lineweaver CH, Cawood PA.   +8 more
europepmc   +1 more source

Protocol for combining BMP, MEK, WNT inhibition and iNGN2 to enable rapid neuronal differentiation and regional patterning from hiPSCs. [PDF]

STAR Protoc
Habich C, Doering A, Manos JD, Cik M, Reinhardt P.   +4 more
europepmc   +1 more source

Protocol for high-throughput drug screening in 384-well 3D collagen cultures of SC colorectal cancer cells using colony morphology as a readout. [PDF]

STAR Protoc
Harmych SJ, Hasaka TP, Jones VT, Bauer JA, Singh B.   +4 more
europepmc   +1 more source

Protocol for dissecting the aggregation-prone protein interactome with optogenetic-induced aggregation and biotin labeling proximity assay. [PDF]

STAR Protoc
Teixeira M, Musiol D, Lambert JP, Oueslati A.   +3 more
europepmc   +1 more source

Self-Propelled Ice on Herringbones. [PDF]

ACS Appl Mater Interfaces
Tapocik JT, Lolla VY, Propst SE, Nath S, Boreyko JB.   +4 more
europepmc   +1 more source

Going for gold: engineering success in elite winter sports. [PDF]

Commun Eng
europepmc   +1 more source

Transport Coefficients of Ice Slurry in Plate Heat Exchanger

, 2004
Pacheco, Hugo Jimenez, Braga, Sergio Leal   +1 more
openaire   +1 more source

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High Speed Copper Plating Process for IC Substrate

IMAPSource Proceedings, 2023
The integrated circuit (IC) substrate occupies an interesting place in electronic devices. They serve as the bridge between the integrated circuits and the PCB. In this connecting point, they must meet the requirements of both worlds. They must provide the high density of connections to match the IC chip, while at the same time be a stable and robust ...
Sean Fleuriel, Confesol Rodriguez, Kesheng Feng, Linyu Pan, Victoire Kayempi Tshitenge, Robert Moon, Dolores Cruz, Jon Hander   +7 more
openaire   +1 more source