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Ultrasonic Spectroscopy for Simulated Plastic IC Packages
ASME 1997 Turbo Asia Conference, 1997Failure analysis of integrated circuit (IC) packages is a critical element for in house quality control and for problems encountered in service. Plastic IC packages are routinely inspected for delaminations, voids, cracks, and corrosion using the C-mode acoustic microscopy (C-AM). Plastic IC packages are hygroscopic and can absorb moisture subjected to
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X-ray photoelectron spectroscopy of amorphous ice
The Journal of Chemical Physics, 1976Bill Baron, Ferd Williams
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