Results 171 to 180 of about 534,062 (314)

VLSI Design Based on Block Truncation Coding for Real-Time Color Image Compression for IoT. [PDF]

open access: yesSensors (Basel), 2023
Chen SL   +8 more
europepmc   +1 more source

Bistable Mechanisms 3D Printing for Mechanically Programmable Vibration Control

open access: yesAdvanced Engineering Materials, EarlyView.
This work introduces a 3D‐printed bistable mechanism integrated into tuned mass dampers (TMDs) for mechanically adaptive passive vibration suppression. Through optimized geometry, the bistable design provides adaptable vibration reduction across a broad range of scenarios, achieving effective vibration mitigation without complex controls or external ...
Ali Zolfagharian   +4 more
wiley   +1 more source

Wavelet compression on detection of brain lesions with magnetic resonance imaging [PDF]

open access: green, 2000
Satoshi Terae   +9 more
openalex   +1 more source

Low‐Activation Compositionally Complex Alloys for Advanced Nuclear Applications—A Review

open access: yesAdvanced Engineering Materials, EarlyView.
Low‐activation compositionally complex alloys (LACCAs) are advanced metallic materials primarily composed of low‐activation elements, offering advantages such as rapid compliance with operational standards and safe recyclability. This review highlights their potential for extreme high‐temperature irradiation environments as structural materials for ...
Yangfan Wang   +8 more
wiley   +1 more source

Multiscale Modeling of Process‐Induced Defects in Fused Filament Fabrication‐Printed Materials

open access: yesAdvanced Engineering Materials, EarlyView.
This study presents a predictive multiscale modeling tool for defect analysis of fused filament fabricated‐printed materials and their performance prediction using a mechanistic data science‐based reduced‐order modeling approach. Process‐induced defects are inherent to additively manufactured parts and significantly influence the performance of printed
Satyajit Mojumder   +3 more
wiley   +1 more source

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