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Hybrid bonding for 3D stacked image sensors: impact of pitch shrinkage on interconnect robustness

International Electron Devices Meeting, 2018
Hybrid bonding is a high-density technology for 3D integration but further interconnect scaling down could jeopardize electrical and reliability performance.
J. Jourdon   +25 more
semanticscholar   +1 more source

3D-Stacked CMOS SPAD Image Sensors: Technology and Applications

International Conference on Electronics, Circuits, and Systems, 2018
3D-stacked CMOS SPAD based image sensors hold the promise for better sensitivity and more functionality per pixel. The technology enables to separate detection from computation onto different chips, or tiers, that are stacked onto one another.
E. Charbon, C. Bruschini, Myung-Jae Lee
semanticscholar   +1 more source

Computational image sensor for on sensor compression

IEEE Transactions on Electron Devices, 1997
In this paper, we propose novel image sensors which compress image signal. By making use of very fast analog processing on the imager plane, the compression sensor can significantly reduce the amount of pixel data output from the sensor. The proposed sensor is intended to overcome the communication bottle neck for high pixel rate imaging such as high ...
T. Hamamoto   +6 more
openaire   +1 more source

Metaphotonic Computational Image Sensors

Imaging and Applied Optics Congress, 2020
Metasurfaces created via multi-scale inverse electromagnetic design method, coupled with computational techniques can create ultra-compact, low-power and low-latency image sensor. We will show our work on such sensors for imaging and depth sensing.
openaire   +1 more source

Thin-film image sensors with a pinned photodiode structure

Nature Electronics, 2023
Jiwon Lee   +18 more
semanticscholar   +1 more source

Phase imaging using shifted wavefront sensor images

Optics Letters, 2014
We propose a new approach to the complete retrieval of a coherent field (amplitude and phase) using the same hardware configuration as a Shack-Hartmann sensor but with two modifications: first, we add a transversally shifted measurement to resolve ambiguities in the measured phase; and second, we employ factored form descent (FFD), an inverse algorithm
Zhengyun, Zhang   +3 more
openaire   +2 more sources

Solid-state image sensors

Sensors and Actuators, 1986
After a short treatment of the basic principles involved in visible-light image sensors the factors determining resolution, sensitivity and dynamic range are discussed. Recent improvements in XY-addressed, interline and frame transfer sensors are presented to demonstrate the versatility of design and technology.
openaire   +1 more source

Germanium imaging sensor

IEEE Journal of Solid-State Circuits, 1970
The development and evaluation of a germanium imaging sensor is described. The sensor, comprised of an electron-beam-scanned photodiode array, was designed for air-glow operation. Surface- barrier photodiode arrays were developed for optimized imaging, and their processing provided a powerful technique for preserving the characteristic properties of ...
D.W. Boone, E.E. Harp, M.M. Whatley
openaire   +1 more source

Imaging optical sensor arrays

Current Opinion in Chemical Biology, 2002
Imaging optical fibres have been etched to prepare microwell arrays. These microwells have been loaded with sensing materials such as bead-based sensors and living cells to create high-density sensor arrays. The extremely small sizes and volumes of the wells enable high sensitivity and high information content sensing capabilities.
openaire   +2 more sources

Single sided imaging sensor

Magnetic Resonance Imaging, 2003
A portable single sided sensor to render depth profiles of MR signal non-invasively is presented. The device utilizes a tailored permanent magnet array producing flat sensitive volumes up to 40 mm from the mobile inspection head. Automated slice selection is performed using a set of switched capacitors in the tuning and receiver circuits.
openaire   +2 more sources

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