Results 251 to 260 of about 92,136 (304)
Some of the next articles are maybe not open access.

Immersion cooling heats up

Communications of the ACM, 2022
Depending on climate conditions, the availability of renewables and other factors, immersion cooling can make a profound difference in both energy consumption and costs.
openaire   +1 more source

Confined Immersion Cooling in Microscale Gaps

2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2020
Thermal management is one of the major operational concerns for data centers and accounts for a significant fraction of total power consumption. Passive immersion cooling solutions have been explored owing to their potential for offering low overall thermal resistance in very dense rack configurations where there is no room for conventional heat sinks ...
Albraa A. Alsaati   +2 more
openaire   +1 more source

Immersion Cooling of Light Emitting Diodes

2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2010
Light emitting diodes (LEDs) historically have been used for indicators and produced low amounts of heat. The introduction of high brightness LEDs with white light and monochromatic colors has allowed them to penetrate specialty and general illumination applications.
Mehmet Arik   +2 more
openaire   +1 more source

Optimization of a Air-Cooled Heatsink for Immersion Cooling Application

ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, 2023
Abstract Data centers have started to adopt immersion cooling for more than just mainframes and supercomputers. Due to the inability of air cooling to cool down recent high-configured servers with higher Thermal Design Power, current thermal requirements in machine learning, AI, blockchain, 5G, edge computing, and high-frequency trading ...
Gautam Gupta   +10 more
openaire   +1 more source

Immersion Cooling of Digital Computers

1994
The present work reviews the theory and practice of direct liquid cooling of microelectronic components. A morphological analysis is suggested for the classification of liquid-cooling concepts. While both immersion and microgroove cooling of chips are discussed, the emphasis is on immersion cooling.
Arthur E. Bergles, Avram Bar-Cohen
openaire   +1 more source

Transport phenomena in immersion-cooled apples

International Journal of Food Science and Technology, 1998
Abstract The effect of immersion chilling and freezing (ICF) process parameters (solution temperature, concentration and composition, initial food temperature) on heat and mass transfer was studied on apple cylinders dipped into a sodium chloride aqueous solution, with particular emphasis on the unsteady-state period (first hour of ...
Lucas, T.   +2 more
openaire   +3 more sources

An innovative method of immersion vacuum cooling for cooked meat products: immersion vacuum cooling with ultrasonic assistance

International Journal of Food Science & Technology, 2020
SummaryIn this paper, immersion vacuum cooling with ultrasonic assistance (IVCUA) is compared with immersion vacuum cooling alone (IVC) and vacuum cooling (VC) for cooling time, mass loss, colour, texture profile and water mobility and compartmentalization for cooked meat products. The results reveal that IVCUA clearly enhances the boiling intensity of
Caihu Liao, Yigang Yu
openaire   +1 more source

Immersion Cooling for High-Density Packaging

IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1987
New cooling techniques using direct immersion cooling for high-density packaging are discussed, focussing on a) the treatment of bubbles produced by nucleate boiling and b) the control of coolant composition to prevent "temperature overshoot" occurring at the boiling point as thermal hysteresis.
K. Yokouchi, N. Kamehara, K. Niwa
openaire   +1 more source

Cost-Efficient Overclocking in Immersion-Cooled Datacenters

2021 ACM/IEEE 48th Annual International Symposium on Computer Architecture (ISCA), 2021
Cloud providers typically use air-based solutions for cooling servers in datacenters. However, increasing transistor counts and the end of Dennard scaling will result in chips with thermal design power that exceeds the capabilities of air cooling in the near future.
Majid Jalili   +10 more
openaire   +1 more source

COOLING OF PORCINE HAM BY OIL IMMERSION

Journal of Food Science, 1970
SUMMARY 12 swine (8 Hampshire and 4 Yorkshire barrows) were selected for this study. Each animal was slaughtered and the hams removed from the “hot” carcass. Individual paired hams from the same animal were placed in 1 of 2 cooling systems (immersion in refrigerated light mineral oil or a forced‐air system). Both systems were operated
C. L. KASTNER   +2 more
openaire   +1 more source

Home - About - Disclaimer - Privacy