Results 281 to 290 of about 81,418 (355)

Laser Micromachining of Liquid Metal Patterns for Stretchable Electronic Circuits

Advanced Materials Technologies, EarlyView.
A cleanroom‐free fabrication strategy combines UV‐laser micromachining with a copper foil wetting layer to rapidly produce high resolution, liquid metal based stretchable electronic circuits on diverse substrates. The scalable, maskless process enables complex circuit designs (<$<$3 h, ∼$\sim$15/device) with excellent electrical stability under strain,
Merjen Palvanova, Patrick McManigal, Grace Fredrickson, Eric J. Markvicka   +3 more
wiley   +1 more source

High-repetition-rate laser-induced damage of indium tin oxide films and polyimide films at a 1064 nm wavelength

, 2019
Liping Peng, Yuanan Zhao, Xiaofeng Liu, Yonggang Liu, Zhaoliang Cao, Meiping Zhu, Jianda Shao, Ruijin Hong, Chunxian Tao, Dawei Zhang   +9 more
openalex   +1 more source

Wireless Power Transfer Modalities for Implantable Bioelectronics: Electromagnetic, Acoustic, and Magneto‐Dynamic Perspectives

Advanced Materials Technologies, EarlyView.
This review traces the evolution of wireless power transfer (WPT) for implantable medical devices, spanning electromagnetic, magnetoelectric, acoustic, and magneto‐dynamic systems. Quantitative comparisons of power, distance, and device scale highlight trade‐offs across modalities, while emerging hybrid mechanisms reveal strategies to overcome ...
Junyeop Kim, Yoonseok Park
wiley   +1 more source

Overcoming Printing and Interfacial Challenges in Liquid Metal Direct Writing for Integrated Stretchable Electronics

Advanced Materials Technologies, EarlyView.
Liquid metal direct writing is advanced from a technological and fundamental point. Utilizing a kinematic bed, printing on large surfaces with irregularities is enabled. Furthermore, a pressure‐driven flow during printing is discovered that affects the thickness of traces.
Maximilian Krack, Lennert Purnal, Parth Vinayakrao Sewlikar, Sam Cuyvers, Gus Geurts, Rathul Nengminza Sangma, Derese Desta, Dieter Reenaers, Bart Ruttens, Iris De Graeve, Tom Hauffman, Seppe Terryn, Bram Vanderborght, Michaël Daenen, Wim Deferme, Monika Rai   +15 more
wiley   +1 more source

Lead‐Free Bismuth Halide Perovskite Memristors: Low‐Voltage Switching and Physical Modeling of Resistive Hysteresis

Advanced Materials Technologies, EarlyView.
Lead‐free bismuth halide perovskite memristors exhibit stable low‐voltage resistive switching behavior. The conductance‐activated quasi‐linear memristor model quantitatively reproduces the experimental hysteresis, confirming ion migration‐driven filament dynamics.
So‐Yeon Kim, Gonzalo Rivera‐Sierra, Bitania Shiferaw Mengesha, Benjamin Iniguez, Juan Bisquert   +4 more
wiley   +1 more source

TADF‐Emitting Dendrimers for Scalable Bar‐Coating Fabrication of Light‐Emitting Electrochemical Cells

Advanced Materials Technologies, EarlyView.
TADF‐emitting dendrimers promise to enable scalable solution‐based fabrication of efficient electroluminescent devices by the virtue of an attractive set of properties. Here, we report on how light‐emitting electrochemical cells, comprising the TADF‐dendrimer tBuCz2m2pTRZ, can be fabricated by scalable bar‐coating under ambient air and deliver uniform ...
Shi Tang, Dianming Sun, Christian Larsen, Erik Zäll, Eli Zysman‐Colman, Ludvig Edman   +5 more
wiley   +1 more source

Recyclable and Binder‐Free EGaIn–Carbon Liquid Metal Composite: A Sustainable Approach for High‐Performance Stretchable Electronics, Thermal‐Interfacing and EMI‐Shielding

Advanced Materials Technologies, EarlyView.
Binder‐free EGaIn–CB composite deliver printable, recyclable liquid‐metal conductors without sintering or polymer binders. Only 1.5 wt% CB yields shear‐thinning, high‐viscosity rheology, ∼60% bulk EGaIn conductivity, robust stretchability, high thermal conductivity, and strong EMI shielding (35 → 70 dB at 100% strain).
Elahe Parvini, Abdollah Hajalilou, Pedro A. Lopes, Tiago A. Morgado, Mahmoud Tavakoli   +4 more
wiley   +1 more source

Two‐Photon Polymerized Microvascular Environments for Multicellular Modeling of the Blood–Brain Tumor Barrier

Advanced Materials Technologies, EarlyView.
Modeling the blood–brain tumor barrier is challenging due to complex interactions between brain microvasculature and glioma cells. We present two‐photon polymerized 3D micro‐porous capillary‐like structures that support endothelial alignment, cytoskeletal organization, and pericyte‐endothelial‐glioma tri‐cultures.
Nastaran Barin, Sayba Z. Chowdhury, Maurice de Wit, Rania Head, Kiki Bals, Erwin Brosens, Marvin M. van Luijn, Hayri E. Balcioglu, Angelo Accardo, Pim J. French   +9 more
wiley   +1 more source

Photonic Hybrid Integration: Strategies and Promises of Advanced Additive Manufacturing

Advanced Optical Materials, EarlyView.
Heterogeneous photonic integration combines wafer bonding, transfer printing, and advanced multi‐photon lithography to realize compact, adaptable photonic systems. This review highlights breakthroughs in hybrid materials, metrology, and 4D printing, revealing how the convergence of traditional and emerging fabrication unlocks scalable, high‐performance
Zhitian Shi, Huiyu Huang, Richard Penty, Qixiang Cheng   +3 more
wiley   +1 more source