Results 111 to 120 of about 13,584 (301)
Advanced Engineering Materials, EarlyView.This study investigates laser‐based oxide removal of Cu inserts in oxygen‐free conditions and examines long‐term oxidation kinetics and surface chemistry under different atmospheres via X‐ray photoelectron spectroscopy. Al–Cu compound casting with differently oxidized surfaces is performed, and intermetallic phase formation, morphology, and thermal ...
Timon Steinhoff +9 more
wiley +1 more source
Interrelations between advanced processing techniques, integrated circuits, materials development and analysis, 1 December 1967 - 30 November 1968 [PDF]
Integrated circuits, diffusion in thin films, and biophysical hazards of ...
Carlson, W. +2 more
core +1 more source
A 24-GHz, +14.5-dBm fully integrated power amplifier in 0.18-μm CMOS [PDF]
, 2005 A 24-GHz +14.5-dBm fully integrated power amplifier with on-chip 50-[ohm] input and output matching is demonstrated in 0.18-μm CMOS. The use of substrate-shielded coplanar waveguide structures for matching networks results in low passive loss and small ...
Hajimiri, Ali +2 more
core
Assessing Altered Coating Adhesion on Plasma‐Deoxidized Surfaces Under Oxygen‐Free Conditions
Advanced Engineering Materials, EarlyView.This study demonstrates the effectiveness of atmospheric pressure plasma pretreatment in modifying silicon and stainless steel surfaces to improve adhesion. Argon‐hydrogen plasma increases surface roughness and improves adhesion strength, whereas pure argon results in smoother surfaces and structural changes.
Selina Raumel +6 more
wiley +1 more source
Advanced Engineering Materials, EarlyView.The wettability of aluminum droplets (Al) on different copper substrates (Cu), where liquid Al spreads on solid Cu surfaces to form a liquid–solid interface, is studied numerically and experimentally. The experimental and numerical results show good agreement in the fast‐spreading regime.
Shan Lyu +8 more
wiley +1 more source
Decoupling Current Ripple in PHIL PMSM Emulation Using LCL Filter: A Fundamental Frequency Analysis
IEEE Open Journal of Power ElectronicsThe traditional machine test benches are known for their inflexibility, safety concerns, weight, and cost. The adoption of Power Hardware-in-the-Loop (PHIL) has been appearing as an enhanced technique to test and validate control algorithms and hardware ...
Nicolas Baschera +4 more
doaj +1 more source
Prototype high angular resolution LEKIDs for NIKA2
, 2018 The current resolution of the NIKA2 260 GHz arrays is limited by the $1.6\times 1.5 mm^2$ inductor size on the individual pixels. In view of future updates of the instrument, we have developed a prototype array with smaller pixels that is experimentally ...
Calvo, Martino +5 more
core +3 more sources
Advanced Engineering Materials, EarlyView.This study demonstrates how optimizing laser power, scanning speed, and hatching distance in laser powder bed fusion can boost the productivity of Inconel 718 manufacturing by up to 29% while maintaining mechanical integrity. The work delivers a validated process window and cost–time analysis, offering industry‐ready guidelines for efficient additive ...
Amir Behjat +7 more
wiley +1 more source
, 2014 Speed is a major concern for high density VLSI networks. In this paper the closed form delay model for current mode signalling in VLSI interconnects has been proposed with resistive load termination. RLC interconnect line is modelled using characteristic
Chandel, Rajeevan +2 more
core +1 more source
Advanced Engineering Materials, EarlyView.A carbon‐free, as‐sintered MgO–steel cermet anode, fabricated via cold isostatic pressing using MgO–C refractory recyclate, was evaluated under laboratory‐scale K‐cryolite electrolysis at 800°C. Operation at this reduced temperature, combined with the electrolyte's limited electrical conductivity, led to an increase in cell voltage.
Farhan Hossain +7 more
wiley +1 more source