Results 41 to 50 of about 385,649 (377)

The Effect of Excited Species on the Collisional Energy of Argon Inductively Coupled Plasmas: A Global Model Study

open access: yesPlasma, 2022
Global modeling of inductively coupled plasma (ICP) reactors is a powerful tool to investigate plasma parameters. In this article, the argon ICP global model is revisited to explore the effect of excited species on collisional energy through the study of
Júlia Karnopp   +3 more
doaj   +1 more source

Analysis of De-Laval nozzle designs employed for plasma figuring of surfaces [PDF]

open access: yes, 2016
Plasma figuring is a dwell time fabrication process that uses a locally delivered chemical reaction through means of an inductively coupled plasma (ICP) torch to correct surface figure errors. This paper presents two investigations for a high temperature
Gourma, Mustapha   +3 more
core   +1 more source

Characterization of a 50kW Inductively Coupled Plasma Torch for Testing of Ablative Thermal Protection Materials Using Non-Air Gases [PDF]

open access: yes, 2018
Thermal protection systems have been a major area of study since the advent of space flight, but recent efforts towards crewed spaceflight missions have placed a new importance on the development of such systems. The 50 kW Inductively Coupled Plasma (ICP)
Cha, Han All
core   +1 more source

Recent development of new inductively coupled thermal plasmas for materials processing

open access: yesAdvances in Physics: X, 2021
This paper explains recent developments in the field of inductively coupled thermal plasmas (ICTP or ITP) used for materials processing. Inductive coupling technique is important to produce thermal plasma with high gas temperature at high pressures ...
Yasunori Tanaka
doaj   +1 more source

Epitaxial aluminium-nitride tunnel barriers grown by nitridation with a plasma source

open access: yes, 2007
High critical current-density (10 to 420 kA/cm^2) superconductor-insulator-superconductor tunnel junctions with aluminium nitride barriers have been realized using a remote nitrogen plasma from an inductively coupled plasma source operated in a pressure ...
C. F. J. Lodewijk   +6 more
core   +2 more sources

Double layer formation in the expanding region of an inductively coupled electronegative plasma

open access: yes, 2015
Double-layers (DLs) were observed in the expanding region of an inductively coupled plasma with $\text{Ar}/\text{SF}\_6$ gas mixtures. No DL was observed in pure argon or $\text{SF}\_6$ fractions below few percent.
Chabert, P., Corr, C. S., Plihon, N.
core   +1 more source

Trace Element Analysis of Minerals in Magmatic-Hydrothermal Ores by Laser Ablation Inductively-Coupled Plasma Mass Spectrometry: Approaches and Opportunities

open access: yes, 2016
Laser ablation inductively-coupled plasma mass spectrometry (LA-ICP-MS) has rapidly established itself as the method of choice for generation of multi-element datasets for specific minerals, with broad applications in Earth science. Variation in absolute
N. Cook   +5 more
semanticscholar   +1 more source

Direct Consolidation of Copper–Graphene Composite by Rotary Swaging

open access: yesAdvanced Engineering Materials, EarlyView.
The applicability of the rotary swaging method for preparation of electroconductive copper–graphene composite by direct consolidation of powders is proven. The consolidated material features advantageous microstructure featuring fine grains and twins, with homogeneous distribution of graphene, primarily along the twin boundaries, which contribute to ...
Radim Kocich   +2 more
wiley   +1 more source

A major gene for grain cadmium accumulation in oat [PDF]

open access: yes, 2008
A population of 150 F2 plants was derived from a cross between two spring oat individuals, one from cv. Aslak (Boreal Plant Breeding LTd., Finland) and the other from cv. Salo (Svalöf-Weibull AB, Sweden).
Kalendar, Ruslan   +3 more
core  

Wafer Bonding Technologies for Microelectromechanical Systems and 3D ICs: Advances, Challenges, and Trends

open access: yesAdvanced Engineering Materials, EarlyView.
This review explores wafer bonding technologies, covering wafer preparation, activation methods, and bonding mechanisms. It compares direct and indirect bonding, highlights recent advancements and future trends, and examines applications in 3D integration and packaging.
Abdul Ahad Khan   +5 more
wiley   +1 more source

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