Results 201 to 210 of about 51,989 (223)
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New AFM imaging for an inline LSI process monitor

SPIE Proceedings, 2002
New imaging technique in AFM has been developed to suppress bending of the sharpened probe during scanning. After analyzing the bending of probe, it is clear that the bending is caused by response of servo control and slipping of the probe on the slope.
Sumio Hosaka   +5 more
openaire   +1 more source

Optimization of E th method for DUV process inline monitor

SPIE Proceedings, 2002
In this paper, we describe the optimization strategy for Eth (Dose to clear) method of DUV resist process control for 0.25um technology. Both experimental and simulation results will be presented to show the optical and developing behaviors of DUV resist in extreme low energy exposure condition.
Wenzhan Zhou   +3 more
openaire   +1 more source

Basic Preexaminations of Inline Monitoring of Process Sprays by Statistical Extinction Method

Particle & Particle Systems Characterization, 2010
AbstractThe objective of this study is to develop a sensor which is able to monitor spray processes by measuring a mean droplet size as well as the droplet concentration. To minimize the manipulation of the spray by the sensor, an optical measurement principle which is called statistical extinction method is used.
Florian Dannigkeit   +2 more
openaire   +1 more source

Inline process monitoring of thermosets by ultrasonic measurements in a compression mould

The Journal of the Acoustical Society of America, 1999
Moulding compounds are heterogeneous materials and consist of granules or pellets, usually mixed with a special resin-hardener combination, reinforcing agents, accelerators, lubricants, pigments, and other additives ready for manufacturing. Thermosetting moulding compounds are defined as raw materials manufacturing plastic parts under the influence of ...
M. Rath   +3 more
openaire   +1 more source

Inline Bondwave Monitoring for Direct Bonding, Process Optimization and Impact on Post-Bond Distortion

ECS Meeting Abstracts, 2023
Direct wafer bonding, named also fusion wafer bonding, is based on the formation of molecular bonds between the two surfaces placed in contact. By the initiation of the contact between the two surfaces the bond is self-propagating: at the initiation point a bondwave is generated, which propagates free until the entire surfaces are in contact (bonded)
Laurent Gaëtan Michaud   +6 more
openaire   +1 more source

Inline Monitoring of CO2 Absorption Processes Using Simple Analytical Techniques and Multivariate Modeling

Chemical Engineering & Technology, 2013
AbstractThe solvent and the dissolved CO2 concentrations are two essential properties of CO2 absorption processes. Currently, they are typically monitored using time‐consuming offline analytical techniques. Initial development efforts aiming at a cost‐effective and reliable inline monitoring system are described.
Ham, L.V. van der   +3 more
openaire   +2 more sources

Statistical Extinction Method for the Inline Monitoring of Particle Processes

2016
The object of this study is to develop a particle measurement system on the basis of the Statistical Extinction Method, which provides an inline monitoring of different particle processes. The Statistical Extinction Method determines from the mean value and root mean square deviation of a transmission signal through a particle collective, a mean ...
Florian Dannigkeit   +2 more
openaire   +1 more source

Inline Viscosity Monitoring of Polymer Solutions Injected in Chemical Enhanced Oil Recovery Processes

SPE Enhanced Oil Recovery Conference, 2013
Abstract The development of chemical enhanced oil recovery projects throughout the world is on a fast pace, led by a will to increase the final recovery of mature and newly developed hydrocarbon reservoirs The validation of the process is usually achieved by implementing an injection pilot; the goal is to understand, secure, and optimize
J. Bonnier   +4 more
openaire   +1 more source

The Study and Investigation of Inline E-Beam Inspection for 28nm Process Window Monitor

2020 China Semiconductor Technology International Conference (CSTIC), 2020
The research aims at the VC (voltage contrast) of contact-loop defects in 28nm processes. A new type defect, marginal via open, was found on 28nm logic product wafer and the designed inline E-beam inspection was used to detect those defects by their VC features. The mechanism of defects and the method of the enhancement of the detection were described.
Yin Long   +4 more
openaire   +1 more source

Application of inline imaging for monitoring crystallization process in a continuous oscillatory baffled crystallizer

AIChE Journal, 2018
In this study, an in situ imaging system has been analysed to characterize the crystal size, the shape and the number of particles during a continuous crystallization process in a Continuous Oscillatory Baffled Crystallizer (COBC). Two image analysis approaches were examined for particle characterization in the suspension containing both small nuclei ...
Rohit Kacker   +3 more
openaire   +1 more source

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