Results 71 to 80 of about 591 (166)
Enhancement of Heat Transfer in PCM by Cellular Zn-Al Structure
Development of open cellular metal foam technology based on investment casting applying the polyurethane pattern is discussed. Technological process comprises preparing of the ceramic mold applying PUR foam as the pattern, firing of the mold, pouring of ...
Naplocha K. +3 more
doaj +1 more source
High‐performance heat‐resistant tactile sensor for intelligent sensing and safe operation
Abstract Tactile sensing in high‐temperature environments remains a critical challenge for robotic systems operating in industrial manufacturing, food processing, and other high‐temperature assembly operations. Herein, we report a heat‐resistant flexible tactile sensor with comprehensive high performance, featuring a hierarchical architecture ...
Yugang Chen +8 more
wiley +1 more source
Features of Cast Iron Smelting in Induction Crucible Furnaces
The article describes the trend towards increased use of induction crucible furnaces for cast iron smelting. The use of gas cupola’s duplex process – induction crucible furnace – has been proved the effective direction of scientific and technical advance
Grachev V.
doaj +1 more source
Chip‐based frequency combs are usually pumped from telecom wavelengths, far from the visible. This work instead pumps close to the visible with a Ti:sapphire laser ‐ the source behind the original optical frequency combs and now becoming chip‐integrable‐ and lets silicon‐nitride waveguides convert it into efficient, octave‐spanning visible‐to‐infrared ...
Abdullah Alabbadi +5 more
wiley +1 more source
A Fully‐Connected Chip‐Integrated Reconfigurable Mode‐Pairing Quantum Key Distribution Network
This work constructs a fully connected reconfigurable chip‐integrated quantum key distribution network via the mode‐pairing protocol. Hybrid ECL and WSS chips cut wavelength and port overhead, realizing arbitrary‐user key sharing with merely two wavelengths.
Xiao‐Lei Jiang +14 more
wiley +1 more source
Micro‐transfer printing enables GaAs and InP gain materials to be integrated on a commercial silicon nitride photonic platform. The resulting chip supports O‐ and C‐band comb and single‐mode lasers, demonstrating a scalable route toward multi‐material, multi‐wavelength, and multifunctional integrated light sources.
Dongbo Wang +12 more
wiley +1 more source
Rearrangement Towards Stability: Plastic Shakedown in Granular Materials Under Thermal Cycles
ABSTRACT Granular materials are routinely subjected to thermal cycling due to natural and anthropogenic phenomena. Despite the ubiquity of this occurrence and its relevance for science, engineering, and technology, the long‐term thermo‐mechanical response of granular materials to repeated heating and cooling remains poorly understood.
Naghmeh Mehraeen +1 more
wiley +1 more source
ABSTRACT The large multinational metalworking industry has increasingly adopted micro‐level circular economy (MLCE) practices; however, the extent to which these initiatives translate into sustainable performance remains insufficiently understood. This study examines the relationship between MLCE and economic, environmental, and social performance ...
Paulo Caracciolo +5 more
wiley +1 more source
A slightly buckled 2D kagome metal‐organic framework (MOF) adsorbed on Ag(111) hosts localized spins which are Kondo‐screened by the underlying metal substrate. Using the tip of a scanning tunneling microscope, the MOF can be vertically manipulated to controllably change its adsorption height and with it, the Kondo coupling strength.
Benjamin Lowe +11 more
wiley +1 more source
This manuscript presents a study on the effects of parameter control of low‐voltage pulsed‐GMA‐AM application for producing 309LSi multilayered build‐ups, which can simultaneously lead to reduced heat input up to 32.1%, enable pulsed‐spray transfer, provide stable depositing conditions and preserve dimensional consistency, favoring fabrication of a 114‐
Petrônio L. C. C. C. Fernandes +4 more
wiley +1 more source

