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Integrated Circuits 3D Silicon Integration

2009 Fourth International Conference on Systems, 2009
One of the most pressing problems in present digital devices are those on-chip and between chips interconnections. Associated with these are the difficulties of placing logic elements as well as routing of their interconnections. As traditional metal-oxide semiconductor field-effect transistor (MOSFET) design and composition are continuously tweaked ...
T. Chammah, T. Giuma
openaire   +1 more source

3D integration of standard integrated circuits

2013 IEEE International 3D Systems Integration Conference (3DIC), 2013
In this paper we present the process and electrical results of a 3D integration using through silicon vias (TSV). A flash memory chip has been directly connected to a processor die. The TSVs have been applied from the wafer front-side into a fully processed advanced CMOS 300 mm wafers using a via last approach.
Rene Puschmann   +12 more
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Optoelectronic integrated circuits

Proceedings of the IEEE, 1987
Monolithic integration of photonic devices such as lasers, modulators, and photodetectors, along with their associated electronic circuitry, has recently made significant advances such that high performance is now being achieved in devices using both the GaAs and InP materials systems. The advances in these optoelectronic integrated circuits, or OEICs,
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Linear integrated circuits

Proceedings of the IEEE, 1985
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Integrated circuit and method of arbitration in a network on an integrated circuit.

The invention relates to an integrated circuit and to a method of arbitration in a network on an integrated circuit. According to the invention, a method of arbitration in a network on an integrated circuit is provided, the network comprising a router unit, the router unit comprising a first input port, a second input port and an output port, wherein ...
Thid, R.L.   +2 more
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High performance integrated photonic circuit based on inverse design method

Opto-Electronic Advances, 2022
Zhuochen Du, Xiaoyong Hu, Jiayu Yang
exaly  

Integrated Circuits

2021
Sebastian Huhn, Rolf Drechsler
openaire   +1 more source

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