Results 241 to 250 of about 677,736 (300)

2D Magnetic and Topological Quantum Materials and Devices for Ultralow Power Spintronics

Advanced Functional Materials, EarlyView.
2D magnets and topological quantum materials enable ultralow‐power spintronics by combining robust magnetic order with symmetry‐protected, Berry‐curvature‐driven transport. Fundamentals of 2D anisotropy and spin‐orbit‐coupling induced band inversion are linked to scalable growth and vdW stacking.
Brahmdutta Dixit, Yifei Yang, Shawn Li, Yu‐Chia Chen, Qi Jia, Jian‐Ping Wang   +5 more
wiley   +1 more source

From Wafers to Electrodes: Transferring Automatic Optical Inspection (AOI) for Multiscale Characterization of Smart Battery Manufacturing

Advanced Functional Materials, EarlyView.
Automat optical inspection (AOI) techniques in semiconductor fabrication can be leveraged in battery manufacturing, enabling scalable detection and analysis of electrode‐ and cell‐level imperfections through AI‐driven analytics and a digital‐twin framework.
Jianyu Li, Ertao Hu, Wei Wei, Feifei Shi
wiley   +1 more source

Mechanoregulatory Effects of Cell‐Scale Microwells on Epithelial Cell Phenotype

Advanced Functional Materials, EarlyView.
In small polycaprolactone microwells, A549 epithelial cells span well edges, in contrast to cells growing on flat substrates. Focal adhesion sites (yellow) concentrate at topographic boundaries, while cytoskeletal tension (magenta stress fibers) is transmitted to the nucleus (blue), reducing nuclear sphericity.
Ruiwen He, Wang Sik Lee, Phattadon Yajan, Aaron Lee, Mauro Sousa de Almeida, Sandeep Keshavan, Jozef Adamcik, Céline Loussert‐Fonta, Dimitri Vanhecke, Barbara Rothen‐Rutishauser, Alke Petri‐Fink   +10 more
wiley   +1 more source

Frontier Advances of Emerging High‐Entropy Anodes in Alkali Metal‐Ion Batteries

Advanced Functional Materials, EarlyView.
Recent advances in microscopic morphology control of high‐entropy anode materials for alkali metal‐ion batteries. Abstract With the growing demand for sustainable energy, portable energy storage systems have become increasingly critical. Among them, the development of rechargeable batteries is primarily driven by breakthroughs in electrode materials ...
Liang Du, Kaidi Zhang, Liang Wang, Di Zhao, Mengqing Hu, Mingli Li, Ming Zhou, Zhenzhen Wu, Mengyang Dong, Bo Fu, Porun Liu, Yun Wang, Hongxia Wang, Yuantong Gu, Lei Zhang   +14 more
wiley   +1 more source

Two‐Way Shape Memory Alloy and Polymer Composite Hybrid Smart Actuator With High Speed, Accuracy, and Reversible Deformation

Advanced Functional Materials, EarlyView.
Tailored thermo‐mechanical properties of shape memory polymer composites enable large reversible deformation as well as high actuation speed. Moreover, a structural design with curvature in the transverse direction achieves sub‐second actuation on heating and a larger recovery ratio on cooling. Finally, these newly developed smart two‐way actuators can
Dajeong Kang, Seong Yeon Park, Yitro Samuel Aditya, Ha Eun Lee, Wonvin Kim, Sangyoon Bae, Seong Su Kim   +6 more
wiley   +1 more source

Photonic Integrated Circuits

MRS Proceedings, 1989
AbstractRecent progress in InP-based photonic integrated circuits (PIC's) is reviewed, with an emphasis on the new level of design complexity and fabrication flexibility afforded by advances in metal-organic-vapor-phase-epitaxy(MOVPE) growth techniques.
T.L. Koch, U. Koren
openaire   +1 more source

Telesensor Integrated Circuits

World Journal of Surgery, 2001
Progress in personal computing has recently permitted small research programs to design and simulate application‐specific integrated circuits (ASICs). Inexpensive fabrication of silicon chips can then be obtained using chip foundries, and quite complex circuits can be greatly reduced in size with an accompanying increase in certain performance ...
T L, Ferrell, C L, Britton, W L, Bryan, L G, Clonts, M S, Emery, M N, Ericson, F, Merraudeau, G W, Morrison, A, Passian, S F, Smith, T D, Threatt, G W, Turner, A L, Wintenberg   +12 more
openaire   +2 more sources

Integrated circuits � Three dimensional integrated circuits

2019
  +8 more sources

Integrated Circuits

2023 International Semiconductor Conference (CAS), 2023
Dale R. Patrick, Stephen W. Fardo, Ray E. Richardson, Vigyan (Vigs) Chandra   +3 more
openaire   +2 more sources