Results 261 to 270 of about 157,997 (307)
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3D integration of standard integrated circuits
2013 IEEE International 3D Systems Integration Conference (3DIC), 2013In this paper we present the process and electrical results of a 3D integration using through silicon vias (TSV). A flash memory chip has been directly connected to a processor die. The TSVs have been applied from the wafer front-side into a fully processed advanced CMOS 300 mm wafers using a via last approach.
Rene Puschmann +12 more
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Optoelectronic integrated circuits
Proceedings of the IEEE, 1987Monolithic integration of photonic devices such as lasers, modulators, and photodetectors, along with their associated electronic circuitry, has recently made significant advances such that high performance is now being achieved in devices using both the GaAs and InP materials systems. The advances in these optoelectronic integrated circuits, or OEICs,
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Recent progress in organic field‐effect transistor‐based integrated circuits
Journal of Polymer Science, 2022Yan Zhao, Yunqi Liu
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2023 International Semiconductor Conference (CAS), 2023
Dale R. Patrick +3 more
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Dale R. Patrick +3 more
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Integrated circuit and method of arbitration in a network on an integrated circuit.
The invention relates to an integrated circuit and to a method of arbitration in a network on an integrated circuit. According to the invention, a method of arbitration in a network on an integrated circuit is provided, the network comprising a router unit, the router unit comprising a first input port, a second input port and an output port, wherein ...Thid, R.L. +2 more
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Emerging Synthesis Strategies of 2D MOFs for Electrical Devices and Integrated Circuits
Small, 2022Sandra Elizabeth Saji +2 more
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Low-cost all-polymer integrated circuits
Applied Physics Letters, 1998M Matters, D M De Leeuw, De Leeuw D M
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