Results 101 to 110 of about 329,754 (334)

Tin‐Based 2D/3D Perovskite Vertical Heterojunction for High‐Performance Synaptic Phototransistors

Advanced Functional Materials, EarlyView.
Phototransistors based on tin‐based 2D/3D perovskite heterostructures show an ultrahigh responsivity and detectivity at a low gate voltage across a broad wavelength region from ultraviolet to near‐infrared. The devices can replicate neuromorphic learning and remembering behaviors to light stimuli, in addition to electric depression and memory erasure ...
Hok‐Leung Loi, Tianyue Wang, Dapeng Liu, Jiupeng Cao, Jing Zhuang, Zeyu Zhao, Yang Xu, Mitch Guijun Li, Liang Li, Tianyou Zhai, Feng Yan   +10 more
wiley   +1 more source

Disulfide Glass: An Optical Polymer for Commodity Plastics, Precision Optics, and Photonics

Advanced Functional Materials, EarlyView.
From oil and glass refining to high performance commodity polymers with enhanced thermomechanical and optical properties—the synthesis of a new high refractive index, highly transparent optical thermoset polymer is reported, termed, disulfide glass that affords a robust optical glass amenable to fabrication of precision optics and thin film photonic ...
Jake Molineux, Sam W. Durfee, Ramses Hyde, Matthew C. Malaker, Jacob P. Narr, Kyung‐Jo Kim, Roland Himmelhuber, Young‐Jae Kim, Min‐Gap Bog, Byeongjoon Jeong, Woongbi Cho, Jeong Jae Wie, Nithiyaa Bala Krishnan, Yi Yan Yang, Robert A. Norwood, Jeffrey Pyun   +15 more
wiley   +1 more source

Hybrid-integrated chalcogenide photonics

Light: Advanced Manufacturing
High-quality photonic materials are critical for promoting integrated photonic devices with broad bandwidths, high efficiencies, and flexibilities for high-volume chip-scale fabrication.
Bin Zhang, Di Xia, Xin Zhao, Lei Wan, Zhaohui Li   +4 more
doaj   +1 more source

Quantum-dot single-photon source on a CMOS silicon photonic chip integrated using transfer printing [PDF]

arXiv, 2018
Silicon photonics is a powerful platform for implementing large-scale photonic integrated circuits (PICs), because of its compatibility with mature complementary-metal-oxide-semiconductor (CMOS) technology. Exploiting silicon-based PICs for quantum photonic information processing (or the so-called silicon quantum photonics) provides a promising pathway
arxiv  

Ultralow-loss integrated photonics enables bright, narrow-band, photon-pair sources [PDF]

Phys. Rev. Lett. 133, 083803 (2024)
Photon-pair sources are critical building blocks for photonic quantum systems. Leveraging Kerr nonlinearity and cavity-enhanced spontaneous four-wave mixing, chip-scale photon-pair sources can be created using microresonators built on photonic integrated circuit.
arxiv   +1 more source

Near‐Field Phonon Nanoscopy and Imaging of Structural Variants in Mixed Phase BiFeO3

Advanced Functional Materials, EarlyView.
Nano‐Fourier transform infrared spectroscopy and scattering scanning near‐field optical microscopy imaging reveal the phonon response of nanoscale phase variants in mixed‐phase BiFeO3 (BFO). Direct mid‐infrared imaging of associated distinct vibrational signatures is used as a non‐invasive optical detection method for electrical switching of ...
Dawei Zhang, En‐Ming You, Lei Wang, Byung‐Kweon Jang, Tanzeela Yousaf, Pengfei Zhang, Jincheol Kim, Chan‐Ho Yang, Jan Seidel   +8 more
wiley   +1 more source

Integrated optomechanics and single-photon detection in diamond photonic integrated circuits

arXiv: Optics, 2016
PhD thesis at the department of physics of the Karlsruhe Institute of Technology (KIT), Advisors: Prof. Dr. Martin Wegener and Prof. Dr. Wolfram Pernice.
openaire   +3 more sources

Regioselective and Anisotropic Multi‐Patching of Small Microparticles via a Polymer Brush‐Assisted Microcontact Printing (µCP)

Advanced Functional Materials, EarlyView.
A method to fabricate anisotropic SiO2 patchy microspheres is presented using a modified microcontact printing technique. This involves a PDMS elastomer stamp with grooved surface topography, creating a confined environment for the microspheres.
Martin Reifarth, Marcel Sperling, Richard Grobe, Pinar Akarsu, Florian Schmitt, Maurice Schmette, Steffen Tank, Katja M. Arndt, Salvatore Chiantia, Matthias Hartlieb, Alexander Böker   +10 more
wiley   +1 more source

Gate‐Tunable Hole Transport in In‐Plane Ge Nanowires by V‐Groove Confined Selective Epitaxy

Advanced Functional Materials, EarlyView.
Ge nanowires are promising for hole spin‐based quantum processors, requiring direct integration onto Si wafers. This work introduces V‐groove‐confined selective epitaxy for in‐plane nanowire growth on Si. Structural and low‐temperature transport measurements confirm their high crystalline quality, gate‐tunable hole densities, and mobility.
Santhanu Panikar Ramanandan, Alban Morelle, Michele Masseroni, Shelly Ben‐David, Sara Martí‐Sánchez, Victor Boureau, Alok Rudra, Thomas Ihn, Jordi Arbiol, W. Craig Carter, Klaus Ensslin, Anna Fontcuberta i Morral   +11 more
wiley   +1 more source

Carbon Nanotube 3D Integrated Circuits: From Design to Applications

Advanced Functional Materials, EarlyView.
As Moore's law approaches its physical limits, carbon nanotube (CNT) 3D integrated circuits (ICs) emerge as a promising alternative due to the miniaturization, high mobility, and low power consumption. CNT 3D ICs in optoelectronics, memory, and monolithic ICs are reviewed while addressing challenges in fabrication, design, and integration.
Han‐Yang Liu, Yun Sun, Dong‐Ming Sun, Hui‐Ming Cheng   +3 more
wiley   +1 more source