Results 261 to 270 of about 135,005 (314)
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Planar interconnects to 3D interconnects
Proceedings of Technical Program of 2012 VLSI Technology, System and Application, 2012Envisioning greater functionality, higher performance and lower power consumption, the semiconductor industry is introducing the first products with 3D interconnects into volume manufacturing. This presentation will trace the transition from planar to 3D interconnects by beginning with the key issues which confronted the scaling of 2D interconnects ...
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12th IEEE International Symposium on Asynchronous Circuits and Systems (ASYNC'06), 2006
We present a novel approach to long-wire signalling. We use the traditional division of long wires into buffered segments, but the delay of each buffer is modulated by signals derived from a timing chain. This creates a circuit element whose timing behaviour is between that of an inverter and that of a latch. We call these "soft latches".
Mark R. Greenstreet, Jihong Ren
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We present a novel approach to long-wire signalling. We use the traditional division of long wires into buffered segments, but the delay of each buffer is modulated by signals derived from a timing chain. This creates a circuit element whose timing behaviour is between that of an inverter and that of a latch. We call these "soft latches".
Mark R. Greenstreet, Jihong Ren
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Annual Review of Materials Research, 2007
The performance and power dissipation of integrated circuits (IC) are largely affected by interconnects. Carbon nanotubes, which are rolls of one-atom-thick carbon sheets, show great potential in addressing some of the major interconnect challenges in future generations of technology, when copper conductivity will degrade substantially because of size ...
Azad Naeemi, James D. Meindl
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The performance and power dissipation of integrated circuits (IC) are largely affected by interconnects. Carbon nanotubes, which are rolls of one-atom-thick carbon sheets, show great potential in addressing some of the major interconnect challenges in future generations of technology, when copper conductivity will degrade substantially because of size ...
Azad Naeemi, James D. Meindl
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2018
In this Chapter we review the state of the art of carbon-based interconnects, presenting the most relevant results in modelling, fabrication, and integration, coming to the most recent applications, where such interconnects were for the first time successfully integrated to CMOS technology.
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In this Chapter we review the state of the art of carbon-based interconnects, presenting the most relevant results in modelling, fabrication, and integration, coming to the most recent applications, where such interconnects were for the first time successfully integrated to CMOS technology.
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Interconnection Networks and Their Eigenvalues
International Journal of Foundations of Computer Science, 2003Interconnection networks of various topologies have been widely used in designing multiprocessor architectures. Study of graph theoretical or combinatorial properties of such networks help us better understand them, as well as develop on these architectures more efficient parallel algorithms including fault-tolerant communication/routing algorithms ...
Ke Qiu 0002, Sajal K. Das 0001
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Shaping interconnect technology for an interconnected society
Proceedings of 2010 International Symposium on VLSI Technology, System and Application, 2010The continuous drive to increase the functionality of electronic products in terms of computational efficiency and versatility requires a broad range of interconnect technologies. This paper presents an overview of advanced CMOS Interconnect technology scaling towards the 10 nm node enabling the increase in 2D computational density.
Rudi Cartuyvels +3 more
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The Hyperstar Interconnection Network
Journal of Parallel and Distributed Computing, 1998zbMATH Open Web Interface contents unavailable due to conflicting licenses.
Abdel Elah Al-Ayyoub, Khaled Day
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Heterogeneity and interconnect
Proceedings of the International Workshop on System Level Interconnect Prediction, 2012The current usage of client devices - smart phones, tracking devices and wearable electronics - force us to take a deep look at energy consumption, they demand long battery life. Energy needs also get exacerbated by the demands of high level of connectivity, the Always On Always Connected usage model expected of such devices.
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Cellular Interconnection Arrays
IEEE Transactions on Computers, 1968Abstract—A class of networks is described that has the capability of permuting in an arbitrary manner a set of n digital input lines onto a set of n digital output lines. The circuitry of the networks is arranged in cellular form, i. e., in a two-dimensional iterative pattern with mainly local intercell connections, where the basic cell behaves as a ...
William H. Kautz +2 more
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Compatibility of behavior interconnections
2003 European Control Conference (ECC), 2003In this paper we discuss the concept of compatible behavior interconnections. We distinguish the case where all variables are available for interconnection (total interconnection) from the case where only a part of them are (partial interconnection). The main idea behind the notion of compatibility for total interconnection is causality of (the effect ...
Julius, Anak Agung +1 more
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