Results 91 to 100 of about 7,005,359 (300)

Defect Evolution and Mechanical Performance of Fused Filament Fabrication‐Manufactured 17‐4PH Stainless Steel Revealed by X‐Ray Computed Tomography

Advanced Engineering Materials, EarlyView.
X‐ray computed tomography reveals how process‐induced defects evolve from green to sintered states in Fused Filament Fabrication (FFF)‐manufactured 17‐4PH stainless steel. Internal porosity, weakest cross‐sections, and fracture locations show strong correlation with tensile performance, demonstrating the potential of computed tomography (CT)‐based ...
György Ledniczky, Márk Sárközi, Ibolya Zsoldos, Zoltán Weltsch   +3 more
wiley   +1 more source

Extrusion‐Based Additive Manufacturing of Advanced Ceramics: Strengthening Mechanisms and Process Optimization Review

Advanced Engineering Materials, EarlyView.
This review comprehensively evaluates extrusion‐based additive manufacturing for advanced ceramics, detailing feedstock options and key process parameters. By critically addressing defect mechanisms like porosity and cracking, the work highlights optimization strategies through machine learning and advanced postprocessing.
Meisam Bakhtiari, Mohammad Hadi Sheikh‐Ansari, Avinash Borgaonkar, Mehran Dadkhah, Abdollah Saboori   +4 more
wiley   +1 more source

Research on Hybrid Amplification Technology of All-optical Data Center Interconnection

Guangtongxin yanjiu, 2023
The accurate evaluation of the communication quality of the interconnection link of the data center is an important basis to realize the coordination in the data network.
WANG Fu-han, HAO Xiang-yong, CAI Yi, WU Min   +3 more
doaj  

Stretching the Printability Metric in Direct‐Ink Writing with Highly Extensible Yield‐Stress Fluids

Advanced Functional Materials, EarlyView.
This study introduces “drawability” as a new metric for assessing printability in direct‐ink writing, focusing on gap‐spanning performance and speed robustness. By designing yield‐stress fluids with high extensibility, we demonstrate that extensional strain‐to‐break significantly enhances printability.
Chaimongkol Saengow, Samya Sen, Joaquin Yus, Eliza E. Lovrich, Amanda G. Hoika, Kelly M. Chang, Arielle A. Pfeil, Nellie Haug, Amy J. Wagoner Johnson, Randy H. Ewoldt   +9 more
wiley   +1 more source

A Workload-Adaptive and Reconfigurable Bus Architecture for Multicore Processors

International Journal of Reconfigurable Computing, 2010
Interconnection networks for multicore processors are traditionally designed to serve a diversity of workloads. However, different workloads or even different execution phases of the same workload may benefit from different interconnect configurations ...
Shoaib Akram, Alexandros Papakonstantinou, Rakesh Kumar, Deming Chen   +3 more
doaj   +1 more source

All‐in‐One Analog AI Hardware: On‐Chip Training and Inference with Conductive‐Metal‐Oxide/HfOx ReRAM Devices

Advanced Functional Materials, EarlyView.
An all‐in‐one analog AI accelerator is presented, enabling on‐chip training, weight retention, and long‐term inference acceleration. It leverages a BEOL‐integrated CMO/HfOx ReRAM array with low‐voltage operation (<1.5 V), multi‐bit capability over 32 states, low programming noise (10 nS), and near‐ideal weight transfer.
Donato Francesco Falcone, Victoria Clerico, Wooseok Choi, Tommaso Stecconi, Folkert Horst, Laura Bégon‐Lours, Matteo Galetta, Antonio La Porta, Nikhil Garg, Fabien Alibart, Bert Jan Offrein, Valeria Bragaglia   +11 more
wiley   +1 more source

t/k-Diagnosability of Regular Networks under the Comparison Model

Sensors
As multiprocessor systems continue to grow in processor scale, the incidence of faults also increases. As a result, fault diagnosis is becoming a key mechanism for maintaining the normal operation of multiprocessor systems.
Jiarong Liang, Mengdie Xiao, Zhi Lin, Changzhen Li   +3 more
doaj   +1 more source

Composites of Shellac and Silver Nanowires as Flexible, Biobased, and Corrosion‐Resistant Transparent Conductive Electrodes

Advanced Functional Materials, EarlyView.
Shellac, a centuries‐old natural resin, is reimagined as a green material for flexible electronics. When combined with silver nanowires, shellac films deliver transparency, conductivity, and stability against humidity. These results position shellac as a sustainable alternative to synthetic polymers for transparent conductors in next‐generation ...
Rahaf Nafez Hussein, Tiago Carneiro Gomes, Eliza Ng, Simon Rondeau‐Gagné, Tricia Breen Carmichael   +4 more
wiley   +1 more source

Oxygen‐Tunnel Indium Tin Oxide Vertical Channel Transistors with Enhanced Current Density and Reliability for Monolithic 3D Compute‐In‐Memory Systems

Advanced Functional Materials, EarlyView.
Oxygen‐tunnel (OT) indium tin oxide (ITO) vertical channel transistors (VCTs) enable reliable, high‐density gain‐cell memory for monolithic 3D integration. A sandwiched SiN/SiO2/SiN OT stack selectively regulates oxygen transport, suppressing parasitic electrode oxidation while stabilizing channel oxygen vacancies, thereby suppressing carrier injection
Hyeonho Gu, Haksoon Jung, Yongwoo Lee, Hoichang Jeong, Yanfeng Zhao, Heesoo Yang, Minho Park, Hyeonjin Lee, Seunghun Baek, Minju Song, Junghwan Kim, Youngmin Jo, Hyunjin Park, Munhyeon Kim, Jae‐Joon Kim, Kyuho Jason Lee, Byungjo Kim, Jimin Kwon   +17 more
wiley   +1 more source

The Generalized 3-Connectivity of Exchanged Folded Hypercubes

Axioms
For S⊆V(G),κG(S) denotes the maximum number k of edge disjoint trees T1,T2,…,Tk in G, such that V(Ti)∩V(Tj)=S for any i,j∈{1,2,…,k} and i≠j. For an integer 2≤r≤|V(G)|, the generalized r-connectivity of G is defined as κr(G)=min{κG(S)|S⊆V(G)and|S|=r}.
Wantao Ning, Hao Li
doaj   +1 more source