Results 201 to 210 of about 11,245,830 (292)

Simulation‐Based Analysis of Insert Pull‐Out in Nickel‐Polyurethane Hybrid Foams Using CT‐Derived Geometries

Advanced Engineering Materials, EarlyView.
CT‐based finite element simulations combined with in situ X‐ray computed tomography are used to analyze insert pull‐out in nickel‐coated polymer foams. Despite variations in material parameters, deformation consistently concentrates within a narrow annular region around the insert.
Yannik Bautz, Jonas Fell, Hendrik Jost, Stefan Diebels, Hans‐Georg Herrmann   +4 more
wiley   +1 more source

Neural signal analysis in chronic stroke: advancing intracortical brain-computer interface design. [PDF]

Front Hum Neurosci
Shawki N, Napoli A, Vargas-Irwin CE, Thompson CK, Donoghue JP, Serruya MD.   +5 more
europepmc   +1 more source

Design of a Multistable Finger Prosthesis with Programmable Metamaterials

Advanced Engineering Materials, EarlyView.
This research article shows the development of a multistable programmble metamaterial for the use as a finger prosthesis. The material was designed on different hierarchical levels where the influence of geometrical parameters and combination of mechanical elements was explored.
Franziska Wenz, Jannik Krohn, Alexander Leichner, Dilip Chalissery, Heiko Andrae, Chris Eberl   +5 more
wiley   +1 more source

Consumer preference study for the interface design of traditional Chinese medicine applications using conjoint analysis method. [PDF]

Sci Rep
Li R, Yang Y.
europepmc   +1 more source

Fabrication Routes for Ionic Conducting Fiber Strain Sensors

Advanced Engineering Materials, EarlyView.
Ionic conducting fiber strain sensors (ICFSs) offer compliant, textile‐integrable sensing. Thus far, the commercialization of ICFSs has been constrained by fiber fabrication routes. This review provides a fabrication‐centric analysis of ICFSs correlating processing strategies with material properties and scalability.
Leo John Kershaw, Zhanhong Yang, Anne Ladegaard Skov, Magdalena Skowyra   +3 more
wiley   +1 more source

Influence of TiC and TiN Ceramic Reinforcements on the Microstructure, Thermal Expansion Behavior, and Tensile Properties of Invar 36 Manufactured by Laser Powder Bed Fusion

Advanced Engineering Materials, EarlyView.
This study examines Invar composites reinforced with titanium carbide (TiC) and titanium nitride (TiN) using laser powder bed fusion (LPBF). It presents the influence of reinforcements on microstructure, tensile properties, and thermal expansion. Results show that TiC effectively strengthens Invar while maintaining low thermal expansion, whereas TiN ...
Ayodeji Nathaniel Oyedeji, Natasha Sacks, Johannes Pötschke, Björn Matthey   +3 more
wiley   +1 more source

State-of-the-Art Carbon-Nanotubes-Reinforced Copper-Based Composites: The Interface Design of CNTs and Cu Matrix. [PDF]

Int J Mol Sci
Ren X, Chang Y, Ge C.
europepmc   +1 more source

Rapidly Solidified High‐Strength Invar 36 Prepared by Planar‐Flow Melt Spinning

Advanced Engineering Materials, EarlyView.
The Invar 36 alloy was rapidly solidified using the planar‐flow melt‐spinning technique. Ribbon samples with thicknesses ranging from 20 to 160 mm were produced. As the grain size of the ribbon decreased to sub‐micron levels, the hardness increased by more than 2 times.
Bekir Akgül, Mehmet Kul
wiley   +1 more source

ProBID-Net: a deep learning model for protein-protein binding interface design. [PDF]

Chem Sci
Chen Z, Ji M, Qian J, Zhang Z, Zhang X, Gao H, Wang H, Wang R, Qi Y.   +8 more
europepmc   +1 more source

Gallium Microalloying in Bi–Sn Solders: Interfacial Phase Formation, Wettability, and Long‐Term Shear Reliability Under Isothermal Aging

Advanced Engineering Materials, EarlyView.
Gallium microalloying redirects interfacial reactions in low‐temperature Bi–Sn solders from Cu–Sn toward Cu–Ga intermetallic formation. The resulting Cu–Ga layer suppresses intermetallic growth during thermal aging, alters fracture pathways, and improves interfacial stability.
Iva Králová, Markéta Klimtová, Mohd Faizul Mohd Sabri, Yew Hoong Wong, Petr Veselý, Martin Plaček, Karel Dušek   +6 more
wiley   +1 more source