Results 101 to 110 of about 31,512 (272)

The intermetallic compound BaAuSb

Acta Crystallographica Section E Structure Reports Online, 2002
The title compound, barium gold antimonide, BaAuSb, is isostructural with ZrBeSi, which adopts the space group P63/mmc. The Au and Sb atoms form planar honeycomb layers, with an Au—Sb distance of 2.7402 (3) A.
Lee, Eun Kwang, Miller, Gordon, Kang, Sung Kwon   +2 more
openaire   +2 more sources

From the Discovery of the Giant Magnetocaloric Effect to the Development of High‐Power‐Density Systems

Advanced Materials Technologies, EarlyView.
The article overviews past and current efforts on caloric materials and systems, highlighting the contributions of Ames National Laboratory to the field. Solid‐state caloric heat pumping is an innovative method that can be implemented in a wide range of cooling and heating applications.
Agata Czernuszewicz, Yaroslav Mudryk, Jun Cui, Lucas Griffith, Duane D. Johnson, Julie Slaughter   +5 more
wiley   +1 more source

Formation and stability of a two-dimensional nickel silicide on Ni (111) an Auger, LEED, STM, and high-resolution photoemission Study

, 2012
Using low energy electron diffraction (LEED), Auger electron spectroscopy (AES), scanning tunnelling microscopy (STM) and high resolution photo-electron spectroscopy (HR-PES) techniques we have studied the annealing effect of one silicon monolayer ...
Aufray, B., Bernardini, J., Girardeaux, C., Lalmi, B., Ottaviani, C., Portavoce, A.   +5 more
core   +5 more sources

Laser‐Based Solidification of Cermets/Cemented Carbides: Processing‐Microstructure‐Property Relationships

Advanced Materials Technologies, EarlyView.
Recent research on laser‐processed cermets and cemented carbides highlights significant advancements, yet a notable paucity of studies and persistent challenges remain. Efforts are increasingly focused on developing low‐cost, environmentally friendly cermets as alternatives to conventional materials.
Himanshu Singh Maurya, Farid Akhtar, Konda Gokuldoss Prashanth   +2 more
wiley   +1 more source

Characteristics and properties of Mg/Al bimetallic solid-phase composite interfaces

工程科学学报
Mg/Al bimetallic layered composites are in great demand for lightweight and high-performance manufacturing applications owing to the advantageous combination of the low density of magnesium alloys and the corrosion resistance of aluminum alloys.
Chunhui WANG, Xintong LI, Lingyun QIAN, Huadong FU, Lanyue CHENG, Chaoyang SUN   +5 more
doaj   +1 more source

The effect of temperature on microstructure and mechanical properties of Al/Mg lap joints manufactured by magnetic pulse welding

Journal of Materials Research and Technology, 2019
The microstructure and mechanical properties of Al/Mg welded joints after heat preservation at different temperatures were examined by optical microscopy (OM), scanning electron microscopy (SEM), energy dispersive spectrometry (EDS) and mechanical ...
Congcong Zhu, Liqiang Sun, Wenli Gao, Guangyao Li, Junjia Cui   +4 more
doaj   +1 more source

Crystal Structure and Ferromagnetism of the CeFe₉Si₄ Intermetallic Compound. [PDF]

Inorg Chem, 2023
Koželj P, Vrtnik S, Boutbien J, Luzar J, Jelen A, Parapari SS, Boulet P, de Weerd MC, Lengaigne G, Wencka M, Fournée V, Ledieu J, Šturm S, Dolinšek J.   +13 more
europepmc   +1 more source

Advancements in TLP Bonding for Power Electronics Die‐Attach Applications

Advanced Materials Technologies, EarlyView.
Transient Liquid Phase (TLP) bonding is gaining traction as a lead‐free die‐attach technology in power electronics packaging. This review examines the state of TLP bonding, its key elements, reliability aspects, and practical limitations. This review also highlights emerging trends, such as nanostructured interfaces, that may improve scalability of TLP
Fatin Battal, Davey Boss, René H. Poelma, Elias Vlieg, John J. Schermer   +4 more
wiley   +1 more source

Finite element modelling of thin intermetallic compound layer fractures

Journal of Mechanical Engineering and Sciences, 2017
A thin intermetallic compound (IMC) of solder ball joint induces strong stress concentration between the pad and solder where a crack propagated near the IMC layer.
Ooi Eang Pang, Ruslizam Daud, Nasrul Amri Mohd Amin, Mohd Afendi Rojan, Mohd Shukry Abd Majid   +4 more
doaj   +1 more source

The Polyol Process and the Synthesis of ζ Intermetallic Compound Ag₅Sn_0.9. [PDF]

Materials (Basel), 2022
Mahayri R, Bousnina MA, Mercone S, Tan KL, Morelle JM, Schoenstein F, Jouini N.   +6 more
europepmc   +1 more source