Results 111 to 120 of about 31,512 (272)

Laser Micromachining of Liquid Metal Patterns for Stretchable Electronic Circuits

open access: yesAdvanced Materials Technologies, EarlyView.
A cleanroom‐free fabrication strategy combines UV‐laser micromachining with a copper foil wetting layer to rapidly produce high resolution, liquid metal based stretchable electronic circuits on diverse substrates. The scalable, maskless process enables complex circuit designs (<$<$3 h, ∼$\sim$15/device) with excellent electrical stability under strain,
Merjen Palvanova   +3 more
wiley   +1 more source

Synthesis of NiAl Intermetallic Compound under Shock-Wave Extrusion. [PDF]

open access: yesMaterials (Basel), 2022
Malakhov A   +4 more
europepmc   +1 more source

Overcoming Printing and Interfacial Challenges in Liquid Metal Direct Writing for Integrated Stretchable Electronics

open access: yesAdvanced Materials Technologies, EarlyView.
Liquid metal direct writing is advanced from a technological and fundamental point. Utilizing a kinematic bed, printing on large surfaces with irregularities is enabled. Furthermore, a pressure‐driven flow during printing is discovered that affects the thickness of traces.
Maximilian Krack   +15 more
wiley   +1 more source

Fabrication of a Porous TiNi3 Intermetallic Compound to Enhance Anti-Corrosion Performance in 1 M KOH

open access: yesMetals
Porous intermetallic compounds have the properties of porous materials as well as a combination of covalent and metallic bonds, and they exhibit high porosity, structural stability, and corrosion resistance.
Zhenli He   +5 more
doaj   +1 more source

Advances in Solid‐Phase Processing Techniques: Innovations, Applications, and Future Perspectives

open access: yesAdvanced Materials Technologies, EarlyView.
Based on practical manufacturing challenges, this review examines advanced solid‐phase processing techniques that overcome the inherent limitations of conventional melting‐based and traditional solid‐phase manufacturing, enabling the production of higher‐performance components at reduced cost through process innovation and improved supply‐chain ...
Tianhao Wang
wiley   +1 more source

Polycation-Polyanion Architecture of the Intermetallic Compound Mg3-xGa1+xIr. [PDF]

open access: yesMolecules, 2022
Sichevych O   +4 more
europepmc   +1 more source

Recyclable and Binder‐Free EGaIn–Carbon Liquid Metal Composite: A Sustainable Approach for High‐Performance Stretchable Electronics, Thermal‐Interfacing and EMI‐Shielding

open access: yesAdvanced Materials Technologies, EarlyView.
Binder‐free EGaIn–CB composite deliver printable, recyclable liquid‐metal conductors without sintering or polymer binders. Only 1.5 wt% CB yields shear‐thinning, high‐viscosity rheology, ∼60% bulk EGaIn conductivity, robust stretchability, high thermal conductivity, and strong EMI shielding (35 → 70 dB at 100% strain).
Elahe Parvini   +4 more
wiley   +1 more source

Incorporating Si into Sb2Se3: Tailoring Optical Phase Change Materials via Nanocomposites

open access: yesAdvanced Optical Materials, EarlyView.
We study the structural, optical, and thermal effects of adding silicon to Sb2Se3 and demonstrate that the as‐deposited solid solution phase segregates after electro‐thermal switching, creating a nanocomposite with effective‐medium properties and a phase‐change response.
Chih‐Yu Lee   +12 more
wiley   +1 more source

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