Results 151 to 160 of about 261,425 (336)
Non‐Functionalized Graphene as an Electrical Sensing Surface for Bacterial Detection
Pathogenic bacteria detection in food remains a major public health concern, driving the need for rapid, cost‐effective, and portable detection systems. This review focuses on the use of non‐functionalized graphene as an electrical sensing surface for bacterial detection, highlighting their unique properties, sensing mechanism, and current developments.
Jazmin Berthe +4 more
wiley +1 more source
The N concentration in an epitaxial VN bilayer is tailored from overstoichiometric V0.49N0.51 to understoichiometric V0.56N0.44. Based on ab initio, diffraction, and microscopy data, the overstoichiometric V0.49N0.51 layer contains V vacancies, N Frenkel pairs, and a high density of dislocations.
Marcus Hans +7 more
wiley +1 more source
SAA significantly enhanced Al/PU bonding, increasing SLSS by up to 920% and fracture energy by 15 100% through optimized micro‐nano porous surfaces. RSM identified the optimal anodizing conditions, while ML confirmed sulfuric acid concentration and roughness as dominant predictors of strength.
Umut Bakhbergen +6 more
wiley +1 more source
Spectroscopic ellipsometry in the Kretschmann‐Raether configuration (KRSE) is employed to characterize a DNA‐functionalized platform for viral sequence recognition. By merging SE with surface plasmon resonance, KRSE outperforms conventional SE, achieving nanomolar targeting through resonance wavelength shifts (δλ) measurements. Its enhanced interfacial
Silvia Maria Cristina Rotondi +4 more
wiley +1 more source
This study highlights the importance of designing photoanode architectures for solar water splitting that align intrinsic material properties with functional interfaces to optimize the extraction of photogenerated charges. The incorporation of NiOx surface layers in LaTiO2.5N0.5 (LTON) thin film photoanodes exemplifies this approach by leveraging band ...
Eric Burns +4 more
wiley +1 more source
METHOD FOR EVALUATION OF INTERNATIONAL ROUGHNESS INDEX
Takuya IKEDA, Naoko HIGASHIJIMA
openaire +2 more sources
Advancements in TLP Bonding for Power Electronics Die‐Attach Applications
Transient Liquid Phase (TLP) bonding is gaining traction as a lead‐free die‐attach technology in power electronics packaging. This review examines the state of TLP bonding, its key elements, reliability aspects, and practical limitations. This review also highlights emerging trends, such as nanostructured interfaces, that may improve scalability of TLP
Fatin Battal +4 more
wiley +1 more source
The paper describes a mathematical model to estimate the parameters of vertical automobile body movements and contact zone loads arrived between of the car with the road surface though index IRI (International Roughness Index).
V.V. Mikhailau, M.G. Salodkaya
doaj
Strategies for Enhancing Thermal Conductivity of PDMS in Electronic Applications
This review explores effective strategies for enhancing heat dissipation in Polydimethylsiloxane (PDMS)‐based composites, focusing on particle optimization, 3D network design, and multifunctional integration. It offers key insights into cutting‐edge methods and simulations that are advancing thermal management in modern electronic devices.
Xiang Yan, Marisol Martin‐Gonzalez
wiley +1 more source

