Results 171 to 180 of about 3,077,553 (314)
Advanced Engineering Materials, EarlyView.Equal channel angular pressing of commercial pure copper under low strain amplitude (≈0.48) induces concurrent continuous and localized discontinuous dynamic recrystallization, forming a duplex structure influenced by strain heterogeneity and recovery. Moderate hardening after 4–12 passes results from progressive high‐angle grain boundary formation via
Paula Cibely Alves Flausino +6 more
wiley +1 more source
Formules exprimant les valeurs des coefficients des séries de puissances inverses [PDF]
, 1946 Franz W. Kamber
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Advanced Engineering Materials, EarlyView.Laser remelting of a CrMnFeCoNi high‐entropy alloy reveals that optimal chemical homogenization occurs between 30 and 40 J·mm−2. Within this range, elemental segregation is reduced by over 30% compared to the as‐cast state. The study establishes this window as a fast, effective alternative to prolonged annealing for achieving uniform elemental ...
Ajay Talbot +5 more
wiley +1 more source
Asymptotic Behaviour Of The Inverse Of a Laplace Transform [PDF]
, 1955 T. E. Hull, Charlotte Froese
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Advanced Engineering Materials, EarlyView.Real‐time imaging and energy‐dispersive diffraction during solidification of Sn‐Bi alloy interconnect for electronic packaging applications are studied. Sn‐Bi solder alloys have generated significant interest in recent times due to their potential use in electronic packaging.
Amey Luktuke +3 more
wiley +1 more source
Formulas for inverse osculatory interpolation in the complex plane
, 1957 H. E. Salzer
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Advanced Functional Materials, EarlyView.In this study, the interplay of dipolar dynamics and ionic charge transport in MOF compounds is investigated. Synthesizing the novel structure CFA‐25 with integrated freely rotating dipolar groups, local and macroscopic effects, including interactions with Cs cations are explored.
Ralph Freund +6 more
wiley +1 more source
Non-Abelian Groups Admitting More Than Half Inverse Correspondencies [PDF]
, 1930 G. A. Miller
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