Results 101 to 110 of about 214,764 (339)

On an Ionic Approximation to Homonuclear Bonding

Zeitschrift für Naturforschung A, 1973
An ionic, i.e. basicly an electrostatic, approximation to homonuclear bonding between several monovalent atoms is examined. A simple correlation seems to exist between molecular constants (bond length and bond energy) and atomic constants (ionization energy and electron affinity).
openaire   +2 more sources

Crossover between ionic-covalent bonding and pure ionic bonding in magnesium oxide clusters [PDF]

Physical Review B, 2003
An empirical potential with fluctuating charges is proposed for modelling (MgO)_n clusters in both the molecular (small n) and bulk (n->infty) regimes. Vectorial polarization forces are explicitely taken into account in the self-consistent determination of the charges.
openaire   +3 more sources

Robocasting of a Water‐Based Biopolymer/WO3 Nanopowder Paste as a Precursor to Tungsten Carbide Lattices

Advanced Engineering Materials, EarlyView.
This study demonstrates a novel, additive manufacturing approach to produce complex, porous tungsten carbide structures using water‐based direct ink writing/robocasting. Leveraging a modified commercial printer and heat treatment, the process yields lightweight, electrically conductive 3D architectures capable of supporting a mechanical load.
James Bentley Bevis, Manasi Shah, Sanketh Gombi, Rodrigo Martinez‐Duarte   +3 more
wiley   +1 more source

Graphene–Catechol Dental Sealant: Antibacterial and Mechanical Evaluation

Advanced Engineering Materials, EarlyView.
This study presents dental sealants made with graphene and L‐DOPA‐modified graphene. L‐DOPA enhances graphene dispersion, improving sealant properties. The material shows antibacterial activity against S. mutans and L. casei, along with high strength and elasticity.
Renata Pereira, Flávio H. B. Aguiar, Rodrigo B. E. Lins, Maria C. A. J. Mainairdi, Bruna G. Silva, Marcela A. Ferretti, Klaus Rischka   +6 more
wiley   +1 more source

Wafer Bonding Technologies for Microelectromechanical Systems and 3D ICs: Advances, Challenges, and Trends

Advanced Engineering Materials, EarlyView.
This review explores wafer bonding technologies, covering wafer preparation, activation methods, and bonding mechanisms. It compares direct and indirect bonding, highlights recent advancements and future trends, and examines applications in 3D integration and packaging.
Abdul Ahad Khan, Tuan‐Khoa Nguyen, Quang Thang Trinh, Nam‐Trung Nguyen, Dzung Viet Dao, Yong Zhu   +5 more
wiley   +1 more source

Ionic bonding, the mechanism of viral uptake by shellfish mucus [PDF]

, 1977
Rudolph Di Girolamo, J. Liston, Jack R. Matches   +2 more
openalex   +1 more source

Direct Electron Detection Electron Energy‐Loss Spectroscopy: Speeding Up 2D Analytical In Situ Transmission Electron Microscopy for Aluminum Alloys

Advanced Engineering Materials, EarlyView.
Scanning transmission electron microscopy imaging techniques are an essential tool to document dynamic developments, such as precipitation in aluminum alloys, during in situ heating experiments using transmission electron microscopy. However, in many cases, chemical information is required to interpret complex nanoscale processes.
Evelin Fisslthaler, Martina Dienstleder, Judith Lammer, Moritz Theissing, Daniel Knez   +4 more
wiley   +1 more source

New Scale of the Ionic Character of the Chemical Bond Using Multiconfiguration SCF Wave Functions [PDF]

, 1981
Kazuhiro Ishida, Shuichi Kadowaki, Teijiro Yonezawa   +2 more
openalex   +1 more source

Study of the Effect of Process Parameters and Heat Treatment on the Formation and Evolution of Directed Energy Deposition of IN718‐CuCrZr Interface

Advanced Engineering Materials, EarlyView.
Bimetallic structures of Inconel 718 and CuCrZr are fabricated using the laser powder directed energy deposition method. The study reveals a strong dependence of interface characteristics such as width and interfusion on processing and heat treatment strategies.
Hamidreza Javidrad, Bahattin Koc
wiley   +1 more source