Results 201 to 210 of about 786,395 (266)

Three-dimensional imaging of subepithelial tumors: feasibility and utility in preoperative assessment-a retrospective single-center observational study in Japan. [PDF]

Clin Endosc
Koizumi E, Goto O, Ishikawa Y, Habu T, Noda H, Nakagome S, Higuchi K, Iwakiri K.   +7 more
europepmc   +1 more source

AQbD Approach Applied to NIR in a Complex Topical Formulation: Bifonazole as Case Study. [PDF]

Pharmaceutics
Chiarentin L, Moura V, Pais AACC, Vitorino C.   +3 more
europepmc   +1 more source

Stability and Perpetuation of Human T-Lymphotropic Virus 1 (HTLV-1) in Intrafamilial Transmissions of Infection in an Endemic Region of the Brazilian Amazon: A Pilot Study. [PDF]

J Trop Med
Pereira CCC, da Silva MCM, Casseb SMM, Dos Reis MNL, Covre LSC, Ishikawa EAY, Dos Santos LM, da Costa CA, de Sousa MS.   +8 more
europepmc   +1 more source

Effect of a self-assembling peptide hydrogel on delayed bleeding following endoscopic sphincterotomy: Prospective pilot cohort study. [PDF]

Endosc Int Open
Ishida Y, Tsuchiya N, Koga T, Kitaguchi T, Matsumoto K, Fukuyama M, Hata K, Nishioka K, Shiga N, Iwasa T, Ishikawa H, Nomaru R, Imakiire S, Matsuoka H, Kuno N, Funakoshi S, Ashizuka S, Sadashima E, Hirai F.   +18 more
europepmc   +1 more source

Reducing wait times for hospital-based outpatient mental healthcare: what works? [PDF]

BMJ Open Qual
Oneschuk H, Tuckerman A, Archer C, Vasudev K.   +3 more
europepmc   +1 more source

Enhancing the rational use of sodium valproate in neurosurgery: a pharmacist-led PDCA intervention. [PDF]

Front Pharmacol
Li Z, Ling Y, Rao G, Li M, Zhao Z, Gong L, Dai S, Shi T.   +7 more
europepmc   +1 more source

Age-Related Differences in Severe Adverse Events During Maintenance Therapy with PARP Inhibitors: A Retrospective Cohort Study in Japanese Patients with Ovarian Cancer. [PDF]

Target Oncol
Nishimyo K, Ishikawa KB, Aoki D, Fushimi K, Yamazaki T.   +4 more
europepmc   +1 more source

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Wire sweep phenomenon overview by Ishikawa diagram

2022 IEEE 24th Electronics Packaging Technology Conference (EPTC), 2022
Wire sweep, the deflection of wires due to package encapsulation by molding compound, is one of the biggest concerns for the correct functionality of a device, due to the risk of crossover and shorting.
Federico Leone, Fulvio Viviani, Elijah Grech, Riccardo Villa   +3 more
openaire   +2 more sources