Results 271 to 280 of about 61,540 (296)

Temperature and crystallinity profiles in polyolefines isothermal and non-isothermal solidification processes

European Polymer Journal, 2003
Temperature and crystallinity profiles developed during the isothermal and dynamic solidification of polypropylene (PP) and high density polyethylene (HDPE), which were measured using different experimental techniques, are analyzed. Appropriate models are developed and used to correlate those experimental results. Profiles obtained by simulation showed
C Albano, J Papa, E González, O Navarro, R González   +4 more
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Isomorphic Material Structures (Isothermal Processes)

1980
Suppose that we have defined, in one and the same particle X two material structures (δ, π, Σ1, ŝ1, e1) and (δ, π, Σ2, S2, e1)
G. Lebon, P. Perzyna
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Ostwald ripening in the isothermal rheocasting process

Acta Metallurgica et Materialia, 1990
Abstract Ostwald ripening in the isothermal rheocasting process has been treated utilizing the third law of thermodynamics to extend the LSW theory to include the case of shear flow in the liquid parent phase. The proposed extended LSW theory predicts that: (1) there exists an upper l imit a stationary particle radius rs, for the particle growth ...
Gang Wan, P.R. Sahm
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Thermodynamics of Non‐Isothermal Coadsorption Processes

Berichte der Bunsengesellschaft für physikalische Chemie, 1987
AbstractPhysical adsorption processes from a multi‐component fluid phase to the internal, inert surface of a single pellet of an adsorbens are considered. — Using the formalism of a generalized thermodynamics of irreversible processes, originally development by Meixner, a set of differential and algebraic equations is established from which the masses ...
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Rapid isothermal processing of silicon wafers

Physics in Technology, 1986
The reduction in the size of semiconductor devices has not only increased their speed and the number that can be fitted on a chip but has also led to the need for very accurately controlled thermal processing of the semiconductor wafers. Conventional furnaces are used as standard in IC processing but now, however, alternative rapid isothermal ...
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Isothermal Displacement Processes With Interphase Mass Transfer

Society of Petroleum Engineers Journal, 1967
Abstract The system of equations describing displacement of a hydrocarbon liquid by a hydrocarbon vapor in a porous medium where mass transfer takes place between the phases is solved numerically for a variety of gas injection processes.
H.W. Price, D.A.T. Donohue
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Isothermal Processes of Homogeneous Filaments

1984
The approach to the First and Second Laws given in Chapters II through V is an abstract one, axiomatic in nature, and permits us to concentrate on those features of physical systems which are central to the formulation and analysis of these laws. The purpose of this chapter is to introduce elementary examples of systems whose state spaces are not of ...
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Isothermal melt processing of Bi-2212 tapes

IEEE Transactions on Appiled Superconductivity, 1999
Isothermal melt processing (IMP) has been used to produce phase-pure, high critical current density (J/sub c/) Bi-2212 tapes at temperatures as low as 780/spl deg/C, Bi-2212 tapes processed by IMP have yielded J/sub c/ values up to 250 kA/cm/sup 2/ (I/sub c/=345 A) at liquid helium temperatures.
T.C. Holesinger, P.S. Baldonado, null Nghia Van Vo, null Weiming Dai, K.R. Marken, null Seungok Hong   +5 more
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Thermodynamic analysis on one isothermal expansion process

AIP Conference Proceedings, 2013
One isothermal expansion process of the ideal gas contained in one tank is analyzed in detailed from the viewpoint of thermodynamics. Simultaneously, we give an insight into why the irreversible process achieves impossibly more work than the reversible process between the same initial and final equilibrium states.
Juanfang Liu, Qinghua Chen
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Isothermal Processing of Thick Nuclear Emulsions

Review of Scientific Instruments, 1955
A method for the processing of thick nuclear emulsions is outlined which develops the tracks of singly charged particles at the minimum of ionization without resort to a hot stage. The developing agent is introduced into the thick layer by means of a series of solutions varying in pH from 4.7 to 7.2 and of increasing reducing power.
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