Results 181 to 190 of about 1,758,148 (348)

Impact of Structural Adhesive Hybridization Strategy on the Performance of In‐Mold Electronics Devices Across Thermoforming and Injection Molding

open access: yesAdvanced Engineering Materials, EarlyView.
In‐mold electronics (IME) undergo complex thermoforming and over‐molding processes that strain device integrity. This study demonstrates how adapting the amount and placement of structural adhesive to local deformation levels preserves electrical functionality.
Francisco Ituriel Arias‐García   +3 more
wiley   +1 more source

Low-Damage Friction Connections in Hybrid Joints of Frames of Reinforced-Concrete Buildings [PDF]

open access: gold, 2023
Piero Colajanni   +3 more
openalex   +1 more source

Surface Modification of Fluorine‐Free Superhydrophobic Materials with (Ultra‐)Thin TiO2 Layers

open access: yesAdvanced Engineering Materials, EarlyView.
Significant changes in wettability, with a reduction of 60o in the water conduct angle, are reported via the surface modification of fluorine‐free superhydrophobic thin films, prepared by aerosol‐assisted chemical vapor deposition, after coating a 4 nm layer of titanium dioxide on the surface using atomic layer deposition.
Julie Jalila Kalmoni   +2 more
wiley   +1 more source

Multimodal Characterization of Sn‐Bi Solder Alloy Solidification Using Synchrotron X‐Ray Microtomography and Energy Dispersive Diffraction

open access: yesAdvanced Engineering Materials, EarlyView.
Real‐time imaging and energy‐dispersive diffraction during solidification of Sn‐Bi alloy interconnect for electronic packaging applications are studied. Sn‐Bi solder alloys have generated significant interest in recent times due to their potential use in electronic packaging.
Amey Luktuke   +3 more
wiley   +1 more source

Feasibility study tool for semi-rigid joints design of high-rise buildings steel structures [PDF]

open access: diamond, 2018
Ruslan Bagautdinov   +3 more
openalex   +1 more source

Programmable Reconfiguration of Hybrid 4D Chiral Metamaterials via Mechanical and Thermal Stimuli

open access: yesAdvanced Engineering Materials, EarlyView.
A class of hybrid chiral mechanical metamaterials is designed to achieve programmable reconfiguration through soft networks, hinges, and bilayer joints integrated with rigid units. Responsive to mechanical and thermal stimuli, these structures exhibit large volume changes, tunable deformation pathways, and both positive and negative thermal expansion ...
Yunyao Jiang, Siyao Liu, Yaning Li
wiley   +1 more source

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