Results 251 to 260 of about 830,316 (365)

Van Der Waals Hybrid Integration of 2D Semimetals for Broadband Photodetection

open access: yesAdvanced Materials, EarlyView.
Advanced broadband photodetector technologies are essential for military and civilian applications. 2D semimetals, with their gapless band structures, high mobility, and topological protection, offer great promise for broadband PDs. This study reviews the latest advancements in broadband PDs utilizing heterostructures that combine 2D semimetals with ...
Xue Li   +9 more
wiley   +1 more source

Advances in Photonic Materials and Integrated Devices for Smart and Digital Healthcare: Bridging the Gap Between Materials and Systems

open access: yesAdvanced Materials, EarlyView.
This article summarizes significant technological advancements in materials, photonic devices, and bio‐interfaced systems, which demonstrate successful applications for impacting human healthcare via improved therapies, advanced diagnostics, and on‐skin health monitoring.
Seunghyeb Ban   +5 more
wiley   +1 more source

Females with FVIII and FIX deficiency have reduced joint range of motion

open access: yesAmerican journal of hematology/oncology, 2014
R. Sidonio   +6 more
semanticscholar   +1 more source

From Mechanoelectric Conversion to Tissue Regeneration: Translational Progress in Piezoelectric Materials

open access: yesAdvanced Materials, EarlyView.
This review highlights recent progress in piezoelectric materials for regenerative medicine, emphasizing their ability to convert mechanical stimuli into bioelectric signals that promote tissue repair. Key discussions cover the intrinsic piezoelectric properties of biological tissues, co‐stimulation cellular mechanisms for tissue regeneration, and ...
Xinyu Wang   +3 more
wiley   +1 more source

Robust Full‐Surface Bonding of Substrate and Electrode for Ultra‐Flexible Sensor Integration

open access: yesAdvanced Materials, EarlyView.
A direct hybrid bonding method that enables both gold and parylene bonding without adhesives is developed. This technique achieves full‐surface direct bonding of electrodes and substrates in flexible electronic connections. The method offers high flexibility, stable mechanical durability, and high‐resolution interconnections, accommodating varying ...
Masahito Takakuwa   +9 more
wiley   +1 more source

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