Results 131 to 140 of about 1,469 (183)
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Analysis of kerf width in micro-WEDM

International Journal of Machine Tools and Manufacture, 2009
In micro-wire electrical discharge machining (micro-WEDM), the machined kerf width varies with different machining parameters, which greatly influences the machining precision. In order to study the kerf variations in micro-WEDM, the mathematical model of wire lateral vibration in machining process is established and its analytical solution is obtained
Xuyang Chu, Di Shichun, Dongbo Wei
exaly   +2 more sources

VISCOELASTIC RESPONSES OF MDF KERF STRUCTURES

American Society for Composites 2021, 2021
Medium-density fiberboard (MDF), comprised of chopped wood fibers and epoxy resin is commonly used in building construction. Given the current trend in freeform architecture, there is a need to generate complex geometric structures out of common construction materials.
ARYABHAT DARNAL   +4 more
openaire   +1 more source

Jet impingement onto kerf: Effect of kerf wedge angle on heat transfer rates and skin friction

Optics and Laser Technology, 2014
Abstract Jet impingement onto a kerf is considered in relation to laser cutting process. Flow and temperature fields are predicted using the three-dimensional modeling. In the simulations influence of kerf wall wedge angle on the Nusselt number and the skin friction at the surface of the kerf wall is examined.
Bekir Sami Yilbas, S Z Shuja
exaly   +2 more sources

Correlation between saw blade width and kerf width

Journal of Forensic Sciences, 2020
AbstractMost studies of saw marks have focused on morphological characteristics and their utility in identifying saws suspected to have been utilized in cases of criminal dismemberment. The present study examined the extent to which metric analysis may be used to correlate saw blade measurements with minimum kerf widths (MKWs). A sample of 56 partially
Melissa Menschel   +2 more
openaire   +2 more sources

Flow characterization in a laser cut kerf

Technical Digest. CLEO/Pacific Rim '99. Pacific Rim Conference on Lasers and Electro-Optics (Cat. No.99TH8464), 2003
Laser cutting is a thermal process that results in higher quality and precision than other thermal processes. In the cutting process, a focused laser beam melts and/or evaporates the material, and a gas jet, coaxial to the beam, blows the molten and/or vaporized material out of the kerf.
H. Horisawa   +3 more
openaire   +1 more source

Exploring kerf cut by abrasive waterjet

The International Journal of Advanced Manufacturing Technology, 2017
Abrasive waterjet (AWJ), due to its unique advantages over the traditional machining process, has been used as a main machining tool extensively. However, the kerf profile defect, which is inherent to AWJ cutting, is one of the major obstructions that limit its applications in high-precision cutting.
Shu Wang   +3 more
openaire   +1 more source

Kerf-Canceling Mechanisms

Proceedings of the 33rd Annual ACM Symposium on User Interface Software and Technology, 2020
Getting laser-cut mechanisms, such as those in micro-scopes, robots, vehicles, etc., to work, requires all their components to be dimensioned precisely. This precision, however, tends to be lost when fabricating on a differ-ent laser cutter, as it is likely to remove more or less mate-rial (aka 'kerf').
Thijs Roumen   +4 more
openaire   +1 more source

An oscillating waterjet deep-kerfing technique

International Journal of Rock Mechanics and Mining Sciences & Geomechanics Abstracts, 1978
Abstract Cutting deep slots in rock with a waterjet requires a nozzle configuration that can cut a kerf wide enough for the nozzle assembly to enter. A tool for cutting such slots, which utilizes an oscillating mechanism, has been developed. This device uses only static seals and is inherently more reliable than a rotating device.
James M. Reichman, John B. Cheung
openaire   +1 more source

Kerf reduction using shaped wire

Conference Record of the Twenty Third IEEE Photovoltaic Specialists Conference - 1993 (Cat. No.93CH3283-9), 2002
The photovoltaic industry is expected to grow at an increased rate and most modules use crystalline silicon wafers. Since silicon material and slicing costs are at least one-third of the module cost, it is imperative that a minimum amount of material is used and that slicing is efficient.
F. Schmid, M.B. Smith, C.P. Khattak
openaire   +1 more source

The Kerf-Cut Dressing

Dermatologic Surgery, 2005
Simple surgical excision is one of the most common treatment methods in the dermatologist's armamentarium. We describe a precise postsurgical dressing technique that can be used for wound care of those patients whose treatment involves removal of lesions via cutaneous surgery.To devise a novel, precise, and effective dressing technique for postsurgical
John, Starling   +2 more
openaire   +2 more sources

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