Results 1 to 10 of about 8,544 (255)

Experimental study on the influence of lapping plate materials on the quality of both sides cylindrical rollers machining [PDF]

open access: yesScientific Reports
The both-sides machining method can obtain high precision cylindrical rollers, but there is a drawback that the lapping plate is easy to wear, which restricts further improvement in the quality of rollers machining.
Tianchen Zhao   +7 more
doaj   +2 more sources

High performance eco-friendly free abrasive machining using an additively fabricated tool and PCD based slurry [PDF]

open access: yesScientific Reports
This paper presents the results from lapping experiments conducted with the use of a lapping plate fabricated by the selective laser sintering (SLS) from the polyamide PA2200 powder. The minimum quantity of diamond grains (grade D107) and paste (grade SD
Dawid Zieliński   +3 more
doaj   +2 more sources

To Lap or Not to Lap [PDF]

open access: yesThe Oncologist, 1996
Abstract Experience at various institutions has shown staging laparotomy to be an important procedure to define a subset of patients who may be treated with radiation therapy alone. Available clinical tests without staging laparotomy understage patients in approximately one-third of the time.
L. Chinsoo Cho   +2 more
openaire   +1 more source

A modified ball screw lapping method and optimized lapping factors for ideal surface quality [PDF]

open access: yesMechanical Sciences, 2018
In order to meet the high precision requirement in various mechanical applications, ball screws are being lapped as a finishing process to improve the travel variation and surface quality. However, the existing manufacturing method is labor intensive.
L. Zhao, H. Feng, J. Jin
doaj   +1 more source

Process research on ultrasonic vibration assisted lapping of single crystal silicon carbide

open access: yesJin'gangshi yu moliao moju gongcheng, 2022
Aimming at the problems such as low material removal rate and abrasive agglomeration when polishing single crystal silicon carbide wafers with traditional methods, this study proposed a ultrasonic vibration assisted lapping method.
Xiaoli HAO   +3 more
doaj   +3 more sources

Material Removal Model for Lapping Process Based on Spiral Groove Density

open access: yesApplied Sciences, 2021
The increasing demand for single-crystal wafers combined with the increase in diameter of semiconductor wafers has warranted further improvements in thickness variation and material removal rate during lapping to ensure price competitiveness of wafers ...
Taekyung Lee   +5 more
doaj   +1 more source

Effect of the Lapping Platen Groove Density on the Characteristics of Microabrasive-Based Lapping

open access: yesMicromachines, 2020
Microabrasive-based lapping is widely used in the manufacturing of single-crystal substrates such as sapphire, SiC, and GaN. Although many studies have been conducted to improve the lapping process characteristics, most of them focused on process ...
Taekyung Lee   +4 more
doaj   +1 more source

APPLICATION OF TAGUCHI AND ANOVA IN OPTIMIZATION OF PROCESS PARAMETERS OF LAPPING OPERATION FOR CAST IRON [PDF]

open access: yesJournal of Mechanical Engineering and Sciences, 2013
Lapping appears like a miraculous process, because it can produce surfaces that are perfectly flat, perfectly round, perfectly smooth, perfectly sharp, or perfectly accurate.
P.R. Parate, R.B. Yarasu
doaj   +3 more sources

Experimental Study on Surface Roughness and Flatness in Lapping of AISI 52100 Steel [PDF]

open access: yesInternational Journal of Advanced Design and Manufacturing Technology, 2016
Lapping is one of the most important polishing processes which can be used to fabricate flat and smooth surfaces. In this paper, the effect of lapping characteristics and mesh number of abrasive particles are studied on the surface roughness and flatness
Masoud Farahnakian, H. ُُShahrajabian
doaj  

Tool Wear Prediction in Single-Sided Lapping Process

open access: yesMachines, 2020
Single-sided lapping is one of the most effective planarization technologies. The process has relatively complex kinematics and it is determined by a number of inputs parameters.
Norbert Piotrowski
doaj   +1 more source

Home - About - Disclaimer - Privacy