Results 161 to 170 of about 67,245 (314)
Deep learning-driven optimization and predictive modeling of LASER beam machining for XG3 steel. [PDF]
Hegde A, Shetty R, Bolar G, Balaji V.
europepmc +1 more source
Improved Electron Beam Quality from External Injection in Laser-Driven Plasma Acceleration at SINBAD
Maria Weikum +9 more
openalex +1 more source
Topological van der Waals contacts represent a new class of electrodes for 2D semiconductors, enabling precise control of the Schottky barrier height (SBH) and contact resistance (RC) through interlayer distance and orbital hybridization engineering. In Se‐based transition metal dichalcogenides, these contacts achieve an ultralow SBH of 7 meV, RC of 0.
Soheil Ghods +15 more
wiley +1 more source
Mid-Wave Infrared Polarization Combiner Based on Reflective Metasurface. [PDF]
Yang L, Wang X, Li X, Dong L.
europepmc +1 more source
Quantum‐Grade Nanodiamonds from a Single‐Step, Industrial‐Scale Pressure and Temperature Process
Novel method for creation of nitrogen‐vacancy centers in 50‐nm nanodiamonds based on high‐temperature plastic deformation is demonstrated. Compared to the electron irradiation approach, it yields nitrogen‐vacancy centers with significantly improved charge stability, T1 relaxation time, and optical Rabi contrast.
Yahua Bao +17 more
wiley +1 more source
Ultra-high-brightness and tuneable attosecond-long electron beams with the laser wake field acceleration. [PDF]
Tomassini P +7 more
europepmc +1 more source
Mesoporous Carbon Thin Films with Large Mesopores as Model Material for Electrochemical Applications
Mesoporous carbon thin films possessing 70 nm mesopores are prepared on titanium substrates by soft templating of resol resins with a self‐synthesized poly(ethylene oxide)‐block‐poly(hexyl acrylate) block copolymer. A strategy to avoid corrosion of the metal substrate is presented, and the films are extensively characterized in terms of morphology ...
Lysander Q. Wagner +9 more
wiley +1 more source
Damage-Free Full-Thickness Dicing of Ultra-Thin GaAs Wafers Using a Femtosecond Laser with Low Residual Stress. [PDF]
Cai S +12 more
europepmc +1 more source

