Results 161 to 170 of about 67,245 (314)

Improved Electron Beam Quality from External Injection in Laser-Driven Plasma Acceleration at SINBAD

open access: green, 2017
Maria Weikum   +9 more
openalex   +1 more source

Selective Charge Injection via Topological van der Waals Contacts for Barrier‐Free p‐Type TMD Transistors

open access: yesAdvanced Functional Materials, EarlyView.
 Topological van der Waals contacts represent a new class of electrodes for 2D semiconductors, enabling precise control of the Schottky barrier height (SBH) and contact resistance (RC) through interlayer distance and orbital hybridization engineering. In Se‐based transition metal dichalcogenides, these contacts achieve an ultralow SBH of 7 meV, RC of 0.
Soheil Ghods   +15 more
wiley   +1 more source

Quantum‐Grade Nanodiamonds from a Single‐Step, Industrial‐Scale Pressure and Temperature Process

open access: yesAdvanced Functional Materials, EarlyView.
Novel method for creation of nitrogen‐vacancy centers in 50‐nm nanodiamonds based on high‐temperature plastic deformation is demonstrated. Compared to the electron irradiation approach, it yields nitrogen‐vacancy centers with significantly improved charge stability, T1 relaxation time, and optical Rabi contrast.
Yahua Bao   +17 more
wiley   +1 more source

Ultra-high-brightness and tuneable attosecond-long electron beams with the laser wake field acceleration. [PDF]

open access: yesSci Rep
Tomassini P   +7 more
europepmc   +1 more source

Mesoporous Carbon Thin Films with Large Mesopores as Model Material for Electrochemical Applications

open access: yesAdvanced Functional Materials, EarlyView.
Mesoporous carbon thin films possessing 70 nm mesopores are prepared on titanium substrates by soft templating of resol resins with a self‐synthesized poly(ethylene oxide)‐block‐poly(hexyl acrylate) block copolymer. A strategy to avoid corrosion of the metal substrate is presented, and the films are extensively characterized in terms of morphology ...
Lysander Q. Wagner   +9 more
wiley   +1 more source

Damage-Free Full-Thickness Dicing of Ultra-Thin GaAs Wafers Using a Femtosecond Laser with Low Residual Stress. [PDF]

open access: yesAdv Sci (Weinh)
Cai S   +12 more
europepmc   +1 more source

Experimental investigations of the influence of laser beam and plasma arc cutting parameters on edge quality of high-strength low-alloy (HSLA) strips and plates

open access: hybrid, 2017
A. Klimpel   +8 more
openalex   +1 more source

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