Results 41 to 50 of about 11,701 (225)
FEMTOSECOND LASER SCRIBING OF SAPPHIRE AT WAVELENGTH 1040 AND 520 NM
Доклады Белорусского государственного университета информатики и радиоэлектроники, 2019 Sapphire cutting is one of the largest markets in laser materials processing. Since sapphire is one of the hardest transparent materials its mechanical and optical properties made it the ideal choice for use in the production of various devices, such as ...
B. A. Shulenkova +5 more
doaj +1 more source
Laser scribing of silicon wafers [PDF]
, 1970 Laser scribing eliminates microcracking at scribe line intersections, minimizes or eliminates preparation of scribe channels, and increases yield during the breaking process. Rapid overlapping of spots in the form of a line permits scribing speeds of 1.5
Calihan, C.
core +1 more source
Advanced Functional Materials, EarlyView.Self‐assembled monolayers (SAMs) are promising hole‐transporting materials for organic photovoltaics (OPVs), but suffer from self‐aggregation and poor large‐area uniformity. We find that interfacial modification using nicotinic hydrazide can eliminate the residual SAM aggregates by forming energetically favorable complexes, yielding uniform SAM.
Seongwon Yoon +10 more
wiley +1 more source
npj Flexible Electronics, 2022 Lightweight and flexible photovoltaic solar cells and modules are promising technologies that may result in the wide usage of light-to-electricity energy conversion devices.
Shogo Ishizuka +2 more
doaj +1 more source
Laser‐Scribed Graphene Oxide Electrodes for Soft Electroactive Devices [PDF]
Advanced Materials Technologies, 2018 AbstractInherently soft electroactive devices will enable a range of novel applications in biomedical, wearable, and robotics technology. In this area, dielectric elastomers (DEs) are particularly promising electromechanical transducers. One major challenge for DEs and other soft devices is the fabrication and precise patterning of thin stretchable ...
Djen T. Kuhnel +2 more
openaire +2 more sources
Advanced Functional Materials, EarlyView.Auxeticity‑by‑Assembly converts freeform photovoltaics from cut‑defined layouts to assembly‑defined systems. Standardized interlocking units generate negative‑Poisson‑ratio, reconfigurable architectures, while hinge regions are wired by selectively activatable AgNW–GO@EGaIn composite interconnects and a folding‑enabled interconnector layer. A decimeter‑
Seok Joon Hwang +15 more
wiley +1 more source
The influence of laser process parameters on the Iron loss of grain-oriented silicon steel
Journal of Materials Research and TechnologyLaser scribing effectively reduces the energy loss of grain-oriented silicon steel in alternating and pulsating magnetic fields. This study focuses on the 27Q120 material, analyzes the macroscopic surface morphology and iron loss variations of grain ...
Wenshuai Zhang +8 more
doaj +1 more source
High Temperature Materials and Processes, 2016 A magnetic domain laser scribing technique of grain-oriented 3.2% silicon steel has been investigated for the direct influencing on the magnetic domain wall.
Puchý V. +4 more
doaj +1 more source
Thermal Processing Creates Water‐Stable PEDOT:PSS Films for Bioelectronics
Advanced Materials, Volume 37, Issue 13, April 2, 2025.Instead of using chemical cross–linkers, it is shown that PEDOT:PSS thin films for bioelectronics become water‐stable after a simple heat treatment. The heat treatment is compatible with a range of rigid and elastomeric substrates and films are stable in vivo for >20 days.
Siddharth Doshi +16 more
wiley +1 more source
Machine Learning Aided Optimization of P1 Laser Scribing Process on Indium Tin Oxide Substrates
Advanced Intelligent SystemsPresent study employes a picosecond laser (532 nm) for selective P1 laser scribing on the indium tin oxide (ITO) layer and subsequent fine‐tuning of P1 scribing conditions with machine learning (ML) techniques.
Vijay C. Karade +12 more
doaj +1 more source