Results 91 to 100 of about 513,175 (343)
Advanced Engineering Materials, EarlyView.A multimaterial approach is introduced to improve upon auxetic structures by combining two different polymers into the same reentrant honeycomb structure via additive manufacturing. The deformation behavior as well as the resulting Poisson's ratio are thereby improved significantly.
Alexander Engel +2 more
wiley +1 more source
Metal-insulator Transition (MIT) Materials for Biomedical Applications [PDF]
, 2019 Transitional metal oxides get considerable interest in electronics and other engineering applications over few decades. These materials show several orders of magnitude metal-insulator transition (MIT) triggered by external stimuli.
Coutu, Ronald A., Jr. +2 more
core +1 more source
Advanced Engineering Materials, EarlyView.This review explores wafer bonding technologies, covering wafer preparation, activation methods, and bonding mechanisms. It compares direct and indirect bonding, highlights recent advancements and future trends, and examines applications in 3D integration and packaging.
Abdul Ahad Khan +5 more
wiley +1 more source
Advanced Engineering Materials, EarlyView.This study investigates the influence of ceramic fillers—aluminum oxide, boron nitride, and a combination of aluminum oxide and zinc oxide—with different particle sizes, on the thermal conductivity of solid silicone rubber. Additionally, the impact of potential synergistic interactions from the simultaneous addition of selected fillers is explored to ...
Aryan Oktaee +3 more
wiley +1 more source
SmartMatFlexible, wearable electronics are the future of electronics. Although organic photovoltaic devices have the advantages of high efficiency, low cost, and flexibility, they face the problem of failure due to the effects of water vapor in the environment ...
Guanran Wang, Yu Duan
doaj +1 more source
Advanced Engineering Materials, EarlyView.Scanning transmission electron microscopy imaging techniques are an essential tool to document dynamic developments, such as precipitation in aluminum alloys, during in situ heating experiments using transmission electron microscopy. However, in many cases, chemical information is required to interpret complex nanoscale processes.
Evelin Fisslthaler +4 more
wiley +1 more source
Characterization of GaN Nanorods Fabricated Using Ni Nanomasking and Reactive Ion Etching: A Top-Down Approach [PDF]
, 2013 Large thermal mismatch between GaN surface and sapphire results in compressive stress in Gallium Nitride (GaN) layer which degrades the device performance.
Christiansen, S. +4 more
core
Advanced Engineering Materials, EarlyView.This article examines how build orientation, thickness, and loading rate affect the tensile and compressive properties of LS‐manufactured polyamide 12 12 parts. Through over 120 experiments, it reveals strong ductility anisotropy in tension, minimal compressive sensitivity, and significant thickness and strain rate dependencies.
Andreas Psarros +2 more
wiley +1 more source
Progress Toward Superconductor Electronics Fabrication Process With Planarized NbN and NbN/Nb Layers [PDF]
, 2023 Sergey K. Tolpygo +7 more
openalex +1 more source
Advanced Engineering Materials, EarlyView.This study identifies 12 wt% indium (In) as the optimal composition for Sn0.5Ag0.7Cu5Bi solder joints, achieving 87% ductile fracture and 81% suppression of intermetallic compound (IMC) growth versus 4 wt% In. High‐In alloys (15–17 wt%) show abnormal IMC thickening due to thermal activation.
Liuwei Wang +11 more
wiley +1 more source