Results 71 to 80 of about 92,346 (216)

Simulation‐Based Analysis of Insert Pull‐Out in Nickel‐Polyurethane Hybrid Foams Using CT‐Derived Geometries

Advanced Engineering Materials, EarlyView.
CT‐based finite element simulations combined with in situ X‐ray computed tomography are used to analyze insert pull‐out in nickel‐coated polymer foams. Despite variations in material parameters, deformation consistently concentrates within a narrow annular region around the insert.
Yannik Bautz, Jonas Fell, Hendrik Jost, Stefan Diebels, Hans‐Georg Herrmann   +4 more
wiley   +1 more source

Fabrication Routes for Ionic Conducting Fiber Strain Sensors

Advanced Engineering Materials, EarlyView.
Ionic conducting fiber strain sensors (ICFSs) offer compliant, textile‐integrable sensing. Thus far, the commercialization of ICFSs has been constrained by fiber fabrication routes. This review provides a fabrication‐centric analysis of ICFSs correlating processing strategies with material properties and scalability.
Leo John Kershaw, Zhanhong Yang, Anne Ladegaard Skov, Magdalena Skowyra   +3 more
wiley   +1 more source

Laser-programmed stiffness and interfaces for textile hybrid electronics

Nature Communications
Permeable textiles show great potential for daily wearable electronics. As crucial electronic components, rigid chips suffer from modulus mismatch with elastic textile substrates, hindering the development of stretchable hybrid electronics.
Huayu Luo, Zimo Cai, Geng Yang, Kangjie Ye, Jian Tang, Tao Liu, Long He, Ying Zhang, Yi Zhu, Haibo Xie, Kewang Nan, Huayong Yang, Michael D. Dickey, Kaichen Xu   +13 more
doaj   +1 more source

Gallium Microalloying in Bi–Sn Solders: Interfacial Phase Formation, Wettability, and Long‐Term Shear Reliability Under Isothermal Aging

Advanced Engineering Materials, EarlyView.
Gallium microalloying redirects interfacial reactions in low‐temperature Bi–Sn solders from Cu–Sn toward Cu–Ga intermetallic formation. The resulting Cu–Ga layer suppresses intermetallic growth during thermal aging, alters fracture pathways, and improves interfacial stability.
Iva Králová, Markéta Klimtová, Mohd Faizul Mohd Sabri, Yew Hoong Wong, Petr Veselý, Martin Plaček, Karel Dušek   +6 more
wiley   +1 more source

Development of low-cost micro-fabrication procedures for planar micro-thermoelectric generators based on thin-film technology for energy harvesting applications.

PLoS ONE
With the rapid proliferation of portable and wearable electronics, energy autonomy through efficient energy harvesting has become paramount. Thermoelectric generators (TEGs) stand out as promising candidates due to their silent operation, high ...
Sobhy M Abdelkader, Donart Nayebare, Tamer F Megahed, Ahmed M R Fath El-Bab, Mohamed A Ismeil, Omar Abdel-Rahim   +5 more
doaj   +1 more source

Toward Full Interoperability in Materials Science: Integrating Workflows With Knowledge Graphs

Advanced Engineering Materials, EarlyView.
The connection of conceptual workflow design, portable execution, and ontology‐based semantics leading to provenance‐rich knowledge graphs are main contributors to interoperability in materials science and a prerequisite to AI‐assisted orchestration and for interoperable Materials Acceleration Platforms.
Jan Janssen, Osamu Waseda, Bernd Bayerlein, Simon Stier, Steffen Brinckmann, Abril Azócar Guzmán, Sarath Menon, Matthias A. Popp, Jesper R. Pedersen, Ivano E. Castelli, Jörg Waitelonis, Wolfgang Wenzel, Jörg Neugebauer, Jörg Schaarschmidt, Tilmann Hickel   +14 more
wiley   +1 more source

Fully biodegradable electrochromic display for disposable patch

npj Flexible Electronics
Flexible and biodegradable electronics have emerged as a promising solution for escalating electronic waste issue caused by the rapid development of skin patch electronics.
Se-Hun Kang, Ju-Yong Lee, Joo-Hyeon Park, Sung-Geun Choi, Sang-Ho Oh, Young-Chang Joo, Seung-Kyun Kang   +6 more
doaj   +1 more source

Functional metallic circuitries created by laser-activated selective electroless plating for 3D customized electronics

Materials & Design
Laser-activated selective electroless plating (LASELP) is a promising complementary manufacturing process employed in hybrid additive manufacturing (HAM) technology for the fabrication of customized 3D electronics.
Hanqiang Zhang, Peiren Wang, Zhen Chen, Xiaoyi Chen, Mingxing Jiang, Junhui Yang, Ji Li   +6 more
doaj   +1 more source

Electronic and optoelectronic applications of solution-processed two-dimensional materials

Science and Technology of Advanced Materials, 2019
The isolation of graphene in 2004 has initiated much interest in two-dimensional (2D) materials. With decades of development, solution processing of 2D materials has becoming very promising due to its large-scale production capability, and it is ...
Jingyun Wang, Bilu Liu
doaj   +1 more source

Materials‐Driven Additive Manufacturing for Electrical Machines: Qualification‐Oriented Design Beyond Geometric Freedom

Advanced Engineering Materials, EarlyView.
This perspective reframes additive manufacturing for electrical machines as a qualification‐limited materials and architecture design problem. It links process–structure–property–performance relationships to magnetic, conducting, dielectric, and thermal property windows, highlighting where AM can enable segmented magnetic circuits, permanent magnet ...
Dénes Fodor, Loránd Szabó
wiley   +1 more source