Results 61 to 70 of about 6,430,984 (211)
Entropy‐Driven Design of Low‐Melting‐Point Alloys via Compositionally Complex Strategy
Advanced Engineering Materials, EarlyView.Conventional low‐melting‐point alloys (LMPAs) are limited by a narrow compositional space and inherent property trade‐offs. This review presents an entropy‐driven design strategy that overcomes these limitations, ushering in a new class of low‐melting‐point compositionally complex alloys (LMCCAs).
Yinghui Shang +6 more
wiley +1 more source
Advanced Electronic MaterialsScalable manufacturing of soft electronics with high performance and reliability represents one of the most demanding challenges for the application of soft electronics. Herein, an ecofriendly silver nanowire (AgNW) based ink with cellulose as the binder
Yuxuan Liu +5 more
doaj +1 more source
Advanced Engineering Materials, EarlyView.CT‐based finite element simulations combined with in situ X‐ray computed tomography are used to analyze insert pull‐out in nickel‐coated polymer foams. Despite variations in material parameters, deformation consistently concentrates within a narrow annular region around the insert.
Yannik Bautz +4 more
wiley +1 more source
Micromachines, 2016 This article presents an overview on typical properties, technologies, and applications of liquid metal based flexible printed electronics. The core manufacturing material—room-temperature liquid metal, currently mainly represented by gallium and its ...
Xuelin Wang, Jing Liu
doaj +1 more source
Large-scale 2D electronics based on single-layer MoS[subscript 2] grown by chemical vapor deposition
, 2012 2D nanoelectronics based on single-layer MoS[subscript 2] offers great advantages for both conventional and ubiquitous applications. This paper discusses the large-scale CVD growth of single-layer MoS[subscript 2] and fabrication of integrated devices ...
L.-J. Li +28 more
core +1 more source
Fabrication Routes for Ionic Conducting Fiber Strain Sensors
Advanced Engineering Materials, EarlyView.Ionic conducting fiber strain sensors (ICFSs) offer compliant, textile‐integrable sensing. Thus far, the commercialization of ICFSs has been constrained by fiber fabrication routes. This review provides a fabrication‐centric analysis of ICFSs correlating processing strategies with material properties and scalability.
Leo John Kershaw +3 more
wiley +1 more source
Advanced Engineering Materials, EarlyView.Gallium microalloying redirects interfacial reactions in low‐temperature Bi–Sn solders from Cu–Sn toward Cu–Ga intermetallic formation. The resulting Cu–Ga layer suppresses intermetallic growth during thermal aging, alters fracture pathways, and improves interfacial stability.
Iva Králová +6 more
wiley +1 more source
Acknowledgment to Reviewers of Electronics in 2020
, 2021 Peer review is the driving force of journal development, and reviewers are gatekeepers who ensure that Electronics maintains its standards for the high quality of its published papers [...
Electronics Editorial Office Electronics Editorial Office +1 more
core +1 more source
Advanced Engineering Materials, EarlyView.This perspective reframes additive manufacturing for electrical machines as a qualification‐limited materials and architecture design problem. It links process–structure–property–performance relationships to magnetic, conducting, dielectric, and thermal property windows, highlighting where AM can enable segmented magnetic circuits, permanent magnet ...
Dénes Fodor, Loránd Szabó
wiley +1 more source
SmartMatFlexible, wearable electronics are the future of electronics. Although organic photovoltaic devices have the advantages of high efficiency, low cost, and flexibility, they face the problem of failure due to the effects of water vapor in the environment ...
Guanran Wang, Yu Duan
doaj +1 more source