Results 121 to 130 of about 4,291,211 (383)
Electronic Structure of Titanylphthalocyanine Layers on Ag(111) [PDF]
We have investigated the electronic structures of axially oxo functionalized titanylphthalocyanine (TiOPc) on Ag(111) by X-ray and ultraviolet photoelectron spectroscopies, two-photon photoemission, X-ray absorption spectroscopy, and X-ray magnetic circular dichroism.
M. Gastaldo+12 more
openaire +5 more sources
Graphene–Catechol Dental Sealant: Antibacterial and Mechanical Evaluation
This study presents dental sealants made with graphene and L‐DOPA‐modified graphene. L‐DOPA enhances graphene dispersion, improving sealant properties. The material shows antibacterial activity against S. mutans and L. casei, along with high strength and elasticity.
Renata Pereira+6 more
wiley +1 more source
Scalable manufacturing of soft electronics with high performance and reliability represents one of the most demanding challenges for the application of soft electronics. Herein, an ecofriendly silver nanowire (AgNW) based ink with cellulose as the binder
Yuxuan Liu+5 more
doaj +1 more source
The role of various alloying elements in face‐centered cubic aluminum on the barrier of a Shockley partial dislocation during its motion is presented. The study aims to understand how alloying atoms such as Mg, Si, and Zr affect the energy landscape for dislocation motion, thus influencing the solid solution hardening and softening in aluminum, which ...
Inna Plyushchay+3 more
wiley +1 more source
A multimaterial approach is introduced to improve upon auxetic structures by combining two different polymers into the same reentrant honeycomb structure via additive manufacturing. The deformation behavior as well as the resulting Poisson's ratio are thereby improved significantly.
Alexander Engel+2 more
wiley +1 more source
Metal-insulator Transition (MIT) Materials for Biomedical Applications [PDF]
Transitional metal oxides get considerable interest in electronics and other engineering applications over few decades. These materials show several orders of magnitude metal-insulator transition (MIT) triggered by external stimuli.
Coutu, Ronald A., Jr.+2 more
core +1 more source
This review explores wafer bonding technologies, covering wafer preparation, activation methods, and bonding mechanisms. It compares direct and indirect bonding, highlights recent advancements and future trends, and examines applications in 3D integration and packaging.
Abdul Ahad Khan+5 more
wiley +1 more source
Flexible, wearable electronics are the future of electronics. Although organic photovoltaic devices have the advantages of high efficiency, low cost, and flexibility, they face the problem of failure due to the effects of water vapor in the environment ...
Guanran Wang, Yu Duan
doaj +1 more source
On-ground tests of LISA PathFinder thermal diagnostics system
Thermal conditions in the LTP, the LISA Technology Package, are required to be very stable, and in such environment precision temperature measurements are also required for various diagnostics objectives.
A Lobo+18 more
core +2 more sources
W‐Based Thin Film Metallic Glasses Doped with Ni, Zr, and B for Industrial Applications
This work is the first to deal with a comprehensive comparison of two metallic glass systems, W–Zr–B and W–Ni–B, in terms of their suitability for specific industrial applications. Their mechanical and tribological properties are compared and discussed in combination with structural homogeneity on different types of technically relevant substrates and ...
Zbynek Studeny+5 more
wiley +1 more source