Results 151 to 160 of about 4,546,528 (308)
Stuffed MO layer as a diffusion barrier in metallizations for high temperature electronics [PDF]
Auger electron spectroscopy was employed to characterize the diffusion barrier properties of molybdenum in the CrSi2/Mo/Au metallization system. The barrier action of Mo was demonstrated to persist even after 2000 hours annealing time at 300 C in a ...
Boah, J. K., Russell, V., Smith, D. P.
core +1 more source
2D layered noble metal dichalcogenides (Pt, Pd, Se, S) for electronics and energy applications
, 2020 Enqi Chen +3 more
openalex +1 more source
Nano-scaled functional layers for current and heat transport in electronics packaging
, 2008 Matthias Heimann +4 more
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Kinetic electronics: Monolithic processing of a layered flexible robotic actuator film for simple film microrobot fabrication [PDF]
, 2021 Shiyi Zhang +3 more
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Polymer-sandwiched ultra-thin silicon(100) layer for flexible electronics
, 2015 Yong-hua Zhang +2 more
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Layer-by-Layer Assembly and UV Photoreduction of Graphene–Polyoxometalate Composite Films for Electronics [PDF]
, 2011 Haolong Li +5 more
openalex +1 more source