Results 81 to 90 of about 6,262,321 (262)

Quantum Electronics [PDF]

, 1981
Contains thirteen research projects split into three sections.U.S. Air Force - Rome Air Development Center (Contract F19628-80-C-0077)National Science Foundation (Grant PHY79-09739)Joint Services Electronics Program (Contract DAAG29-78-C-0020)Joint ...
Davis, James L., Tench, Robert E., Picard, R. H., Willis, C. R., Meyer, Raymond E., Schloss, Robert P., Sanders, Glen A., Prentiss, Mara G., Ezekiel, Shaoul, Haus, Hermann A., Peuse, Bruce W., Hemmer, Philip R., Fonstad, Clifton G., Thomas, John E., Leiby, C. C., Jr., Ponikvar, Donald R.   +15 more
core  

Acknowledgement to Reviewers of Electronics in 2016

, 2017
The editors of Electronics would like to express their sincere gratitude to the following reviewers for assessing manuscripts in 2016.[...
Electronics Editorial Office
core   +1 more source

Efforts of implementing ultra‐flexible thin‐film encapsulation for optoelectronic devices based on atomic layer deposition technology

SmartMat
Flexible, wearable electronics are the future of electronics. Although organic photovoltaic devices have the advantages of high efficiency, low cost, and flexibility, they face the problem of failure due to the effects of water vapor in the environment ...
Guanran Wang, Yu Duan
doaj   +1 more source

Comparison of Triply Periodic Minimal Surface Energy Absorbers Under Uniaxial Compressive Loading

Advanced Engineering Materials, EarlyView.
This study investigates LCD 3D printed Triply Periodic Minimal Surface (TPMS) structures as mechanical energy absorbers. By comparing various base designs and layered combinations under uniaxial compression, it identifies that a Diamond‐Gyroid sandwich structure offers superior performance.
Sergej Grednev, Noah‐Lean Roschlaub, Anne Jung   +2 more
wiley   +1 more source

From Energy Efficiency to Energy Intelligence: Power Electronics as the Cognitive Layer of the Energy Transition

The exponential growth of artificial intelligence (AI), electrified transport, and renewable generation is accelerating a structural shift in how societies produce, deliver, and consume electricity.
Nikolay Hinov
core   +1 more source

Quantum Electronics [PDF]

, 1976
Contains reports on three research projects.Joint Services Electronics Program (Contract DAAB07-75-C ...
Ezekiel, Shaoul, Grove, Robert E., Haus, Hermann A., Hagelstein, Peter L., Wu, Frederick Y-F., Lipchak, W. Michael   +5 more
core  

Single-Layer MoS2 Electronics [PDF]

CONSPECTUS: Atomic crystals of two-dimensional materials consisting of single sheets extracted from layered materials are gaining increasing attention.
Bertolazzi, Simone, Lembke, Dominik, Kis, Andras   +2 more
core   +2 more sources

Robust Oxide Thin-Film Transistors With Embedded CNT Buried Layer for Stretchable Electronics

IEEE Journal of the Electron Devices Society, 2019
We report the impact of carbon nanotube (CNT) buried layer in the middle of 7 μm polyimide (PI) substrate on the electrical performance of amorphous-indium-gallium-zinc-oxide (a-IGZO) thin-film transistors (TFTs) by repetitive mechanical ...
Md Mehedi Hasan, Mohammad Masum Billah, Xiuling Li, Jin Jang   +3 more
doaj   +1 more source

A Practical Noise2Noise Denoising Pipeline for High‐Throughput Raman Spectroscopy

Advanced Engineering Materials, EarlyView.
A lightweight and reproducible denoising pipeline for high‐throughput Raman spectroscopy is introduced, based on a 1D convolutional autoencoder trained with a Noise2Noise strategy. Using only repeated short‐exposure acquisitions, the method suppresses stochastic noise without reference spectra, enabling reliable spectral reconstruction while preserving
David Martin‐Calle, Cesar Alvarez‐Llamas, Vincent Motto‐Ros, Christophe Dujardin, Jérémie Margueritat, David Rodney   +5 more
wiley   +1 more source

OntOMat: Toward Ontology‐Based Product and Process Design Engineering and Optimization Solutions Fueling Circular Value Chains

Advanced Engineering Materials, EarlyView.
The OntOMat ontology establishes a structured framework for polymer matrix fiber reinforced composite materials, integrating manufacturing processes, characterization methods, and multiscale design through the VDI/VDE 3682 formalized process description standard.
Nicolas Christ, Jörg Hohe, Martin Kördel, Michael Giese, Niklas Toffert, Christian Seidel, Olaf Rehme, Patrik Schneider, Oliver Focke, Elie Abi Aoun, Claas Falldorf, Beñat Gutierrez, Alexandra Kühn, Sven Torstrick-von der Lieth, Christoph Herden, Erik Johannsen, Jan‐Uwe R. Schmidt, Felix Winkelmann, Andreas Schott, Daniel Schott   +19 more
wiley   +1 more source