Results 181 to 190 of about 4,546,528 (308)

Molecular electronics using an engineered sharp structure in the electrode density-of-states. Negative differential resistance and Resonant Tunneling in a poled molecular layer on Al/LiF electrodes.

, 2004
M. W. C. Dharma‐wardana, Marek Z. Zgierski, Douglas Ritchie   +2 more
openalex  

MXene-Based High-Performance Soft Pressure Sensor Using Gel-Deep Eutectic Solvent Composite. [PDF]

Micromachines (Basel)
Sasaki R, Tou K, Kamanoi S, Yoshida J, Takabe Y, Miura Y, Kamiya E, Hirayama A, Sekine T.   +8 more
europepmc   +1 more source

Ultrathin Silicon Circuits With Strain‐Isolation Layers and Mesh Layouts for High‐Performance Electronics on Fabric, Vinyl, Leather, and Paper

, 2009
Dae‐Hyeong Kim, Yun‐Soung Kim, Jian Wu, Zhuangjian Liu, Jizhou Song, Hoon‐Sik Kim, Yonggang Huang, Ao Wang, John A. Rogers   +8 more
openalex   +2 more sources

A Soft Capacitive Pressure Sensor Based on a Liquid Dielectric Layer. [PDF]

Sensors (Basel)
Zhang M, Qiu C, Wang J, Huang X, Zhang W, Chin LK, Shang W.   +6 more
europepmc   +1 more source

From Printed Devices to Vertically Stacked, 3D Flexible Hybrid Systems. [PDF]

Adv Mater
Liu F, Christou A, Dahiya AS, Dahiya R.
europepmc   +1 more source

Integrating Hard Silicon for High-Performance Soft Electronics via Geometry Engineering. [PDF]

Nanomicro Lett
Yan L, Liu Z, Wang J, Yu L.
europepmc   +1 more source

Characterizing the Nanoscale Layers of Tomorrow___s Electronics An Application of Fourier Analysis

, 2012
Christopher Bishop Payne
openalex   +2 more sources

A Review of Photonic Sintering of Non-Oxide Ceramics for Printed Electronics. [PDF]

Materials (Basel)
Gerlein LF, Taherian MH, Bolduc M.
europepmc   +1 more source

A layer-by-layer approach to spin-based electronics [PDF]

, 2008

openalex   +1 more source

Dispersion-engineered spin photonics based on folded-path metasurfaces. [PDF]

Light Sci Appl
Zhang F, Bao H, Pu M, Guo Y, Kang T, Li X, He Q, Xu M, Ma X, Luo X.   +9 more
europepmc   +1 more source