Breaking the Capacity Limit for WO3 Anode‐Based Li‐Ion Batteries Using Photo‐Assisted Charging
This image illustrates a photo‐assisted rechargeable lithium‐ion battery. (a) shows the battery structure, where light enhances electron‐hole generation in the anode, boosting ion flow. (b) compares discharging performance, revealing over 60% higher capacity under light compared to dark conditions, showcasing the benefit of light‐assisted energy ...
Rabia Khatoon+7 more
wiley +1 more source
From Printed Devices to Vertically Stacked, 3D Flexible Hybrid Systems. [PDF]
Liu F, Christou A, Dahiya AS, Dahiya R.
europepmc +1 more source
Unravelling charge transport mechanisms in graphene nanosheet networks: by combining temperature‐dependent conductivity measurements with a Random Resistor Network model, this study identifies a transition from hopping‐dominated conduction to a band‐like transport mechanism.
Alessandro Grillo+9 more
wiley +1 more source
Self-packaged stretchable printed circuits with ligand-bound liquid metal particles in elastomer. [PDF]
Seo H+14 more
europepmc +1 more source
Miniaturized Soft and Stretchable Multilayer Circuits through Laser-Defined High Aspect-Ratio Printing. [PDF]
Mohammadi M+7 more
europepmc +1 more source
Laser-induced graphene points to sustainable electronics. [PDF]
Ornes S.
europepmc +1 more source
Flexible and Twistable ZnMn<sub>2</sub>O<sub>4</sub>-Electrodeposited Yarn Supercapacitors for Wearable Electronics. [PDF]
Rani S+8 more
europepmc +1 more source
Fabrication and Characterization of a PZT-Based Touch Sensor Using Combined Spin-Coating and Sputtering Methods. [PDF]
Ozden M, Coban O, Karacali T.
europepmc +1 more source
Engineering solvent resistance in semiconducting polymer films through UV-induced polydiacetylene crosslinking. [PDF]
Sur AK+5 more
europepmc +1 more source
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Unique multi -level metal layer electronics solutions offered by advanced 3D printing
IEEE Electron Devices Technology and Manufacturing Conference, 2022Integrated additively manufactured electronics (AME) is a novel manufacturing technique enabled by the recent progress in simultaneous 3D printing of dielectric materials and conductive inks with flexible interlayer distance.
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