Packaging technology enabling flexible optical interconnections [PDF]
, 2011 This paper reports on the latest trends and results on the integration of optical and opto-electronic devices and interconnections inside flexible carrier materials.
Bosman, Erwin +5 more
core +1 more source
Advanced Electronic Materials, 2023 Oxide semiconductor thin‐film transistors (TFTs) with low‐voltage operation, excellent device performance, and bias stability are highly desirable for portable and wearable electronics.
Jidong Jin +6 more
doaj +1 more source
Skin-Inspired Pressure Sensor with MXene/P(VDF-TrFE-CFE) as Active Layer for Wearable Electronics
Nanomaterials, 2021 Multi-functional electronic skin is of paramount significance for wearable electronics in health monitoring, medical analysis, and human-machine interfacing systems.
Xiao-Quan Shen +3 more
doaj +1 more source
A simple and versatile micro contact printing method for generating carbon nanotubes patterns on various substrates [PDF]
, 2012 We present an optimized process for generating at low cost, patterns of carbon nanotubes (CNTs) on a large variety of substrates through a simple micro contact printing method.
Béduer, Amélie +3 more
core +2 more sources
Glucose-based resistive random access memory for transient electronics
Journal of Information Display, 2019 In this research, glucose was adopted as the switching layer of resistive random access memory (RRAM) for transient electronics. The fabricated glucose-based RRAM showed bipolar switching behavior with stable endurance (100 cycles) and retention (104 ...
Sung Pyo Park +3 more
doaj +1 more source
Hierarchically Multifunctional Polyimide Composite Films with Strongly Enhanced Thermal Conductivity
Nano-Micro Letters, 2021 The development of lightweight and integration for electronics requires flexible films with high thermal conductivity and electromagnetic interference (EMI) shielding to overcome heat accumulation and electromagnetic radiation pollution.
Yongqiang Guo +4 more
doaj +1 more source
Low-Cost and Green Fabrication of Polymer Electronic Devices by Push-Coating of the Polymer Active Layers [PDF]
, 2017 Because of both its easy processability and compatibility with roll-to-roll processes, polymer electronics is considered to be the most promising technology for the future generation of low-cost electronic devices such as light-emitting diodes and solar ...
Vohra, Varun +5 more
core +2 more sources
Interrogating the superconductor Ca10(Pt4As8)(Fe2-xPtxAs2)5 Layer-by-layer [PDF]
Scientific Reports 6, 35365 (2016), 2016 Ever since the discovery of high-Tc superconductivity in layered cuprates, the roles that individual layers play have been debated, due to difficulty in layer-by-layer characterization. While there is similar challenge in many Fe-based layered superconductors, the newly-discovered Ca10(Pt4As8)(Fe2As2)5 provides opportunities to explore ...
arxiv +1 more source
Structurally Embedded Electrical Systems Using Ultrasonic Consolidation (UC) [PDF]
, 2006 Current research has demonstrated the use of Ultrasonic Consolidation (UC) to embed several USB-based sensors into aluminum, and is working toward embedding suites of sensors, heaters and other devices, connected via USB hubs, which can be monitored ...
Eames, Brandon +3 more
core +1 more source
Substrate‐Free Transfer of Large‐Area Ultra‐Thin Electronics
Advanced Electronic Materials, 2023 Innovation in materials and technologies has promoted the fabrication of thin‐film electronics on substrates previously considered incompatible because of their chemical or mechanical properties.
Hugo De Souza Oliveira +5 more
doaj +1 more source