Results 41 to 50 of about 536,412 (348)

Structural biology of ferritin nanocages

FEBS Letters, EarlyView.
Ferritin is a conserved iron‐storage protein that sequesters iron as a ferric mineral core within a nanocage, protecting cells from oxidative damage and maintaining iron homeostasis. This review discusses ferritin biology, structure, and function, and highlights recent cryo‐EM studies revealing mechanisms of ferritinophagy, cellular iron uptake, and ...
Eloise Mastrangelo, Flavio Di Pisa
wiley   +1 more source

Novel highly conductive and transparent graphene based conductors [PDF]

, 2012
Future wearable electronics, displays and photovoltaic devices rely on highly conductive, transparent and yet mechanically flexible materials. Nowadays indium tin oxide (ITO) is the most wide spread transparent conductor in optoelectronic applications ...
Barnes, William L., Bointon, Thomas H., Craciun, Monica F., Khrapach, Ivan, Polyushkin, Dmitry K., Russo, Saverio, Withers, Freddie   +6 more
core   +2 more sources

Interrogating the immune landscape of microsatellite stable RAS‐mutated colon cancer

Molecular Oncology, EarlyView.
COLOSSUS project RAS‐mutated MSS colon cancer study explored transcriptomics and immune cell density by immunohistochemistry (IHC), Immunoscore (IS), ISIC/TuLIS scores, mutation counts, and detected different prevalences but similar microenvironment composition across immune markers with clinical relevance for future immunotherapy combination ...
Rodrigo Dienstmann, Eduardo García‐Galea, Alice O'Farrell, Zak Kinsella, Maxime Meylan, Florent Petitprez, Ingrid Arijs, Tom Venken, Hari Ps, Adrian Lärkeryd, Ian Miller, Janick Selves, Nadja Meindl‐Beinker, Fiorella Ruiz‐Pace, Elena Élez, Raquel Comas‐Navarro, Frank Lincoln, Dirk Fey, Gift Nyamundanda, Aoife Nolan, Joern Lewin, Raquel Perez‐Lopez, Jonathan Briody, Kathleen Bennett, Walter Kolch, David Matallanas, Alexander Kel, Enrique Arenas, Joaquín Arribas, Bart Ghesquière, Josep Tabernero, Julie Meilleroux, Deborah McNamara, Ray McDermott, Marvin Lim, Mary O'Reilly, Brian Bird, Lisa Stack, Lucia Moloney, Patrick Morris, Keith Egan, Maciej Milewski, Lars Scheuer, Joachim Behringer, Georg Bolz, Ramon Salazar, Cristina Santos, Andrea Ruiz, Orla Casey, Verena Murphy, Matthias Ebert, Livio Trusolino, Diether Lambrechts, Anguraj Sadanandam, Catherine Sautès‐Fridman, Jochen Prehn, Paolo Nuciforo, Jacques Fieschi, Florence Monville, Darran O'Connor, Wolf Fridman, Annette Byrne   +61 more
wiley   +1 more source

Simulation of the Recharging Method of Implantable Biosensors Based on a Wearable Incoherent Light Source

Sensors, 2014
Recharging implantable electronics from the outside of the human body is very important for applications such as implantable biosensors and other implantable electronics.
Yong Song, Qun Hao, Xianyue Kong, Lanxin Hu, Jie Cao, Tianxin Gao   +5 more
doaj   +1 more source

Monolithic Pixel Sensors in Deep-Submicron SOI Technology with Analog and Digital Pixels

, 2008
This paper presents the design and test results of a prototype monolithic pixel sensor manufactured in deep-submicron fully-depleted Silicon-On-Insulator (SOI) CMOS technology.
Battaglia, Battaglia, Battaglia, Chinh Vu, Dario Bisello, Deptuch, Devis Contarato, Gaede, Gornushkin, Lindsay Glesener, Marco Battaglia, Marczewski, Marczewski, McMahan, McMahan, Niemiec, Peter Denes, Piero Giubilato, Serena Mattiazzo, Tsuboyama   +19 more
core   +1 more source

Construction and commissioning of a technological prototype of a high-granularity semi-digital hadronic calorimeter [PDF]

, 2015
A large prototype of 1.3m3 was designed and built as a demonstrator of the semi-digital hadronic calorimeter (SDHCAL) concept proposed for the future ILC experiments. The prototype is a sampling hadronic calorimeter of 48 units.
Almillo, E. Calvo, Baulieu, G., Bedjidian, M., Belkadhi, K., Berenguer, J., Boudry, V., Calabria, P., Callier, S., Cap, S., Caponetto, L., Combaret, C., Cornat, R., Davin, F., de Callatay, B., de la Taille, C., Delaunay, D., Dellanegra, R., Doizon, F., Donckt, M. Vander, Dulucq, F., Eynard, A., Fouz, M-C., Gastaldi, F., Germani, L., Gil, E. Cortina, Grenier, G., Haddad, Y., Han, R., Ianigro, J-C., Kieffer, R., Laktineh, I., Lumb, N., Manai, K., Mannai, S., Mathez, H., Mirabito, L., Pelayo, J. Puerta, Prast, J., Ruan, M., Schirra, F., Seguin-Moreau, N., Steen, A., Tromeur, W., Tytgat, M., Vouters, G., Zaganidis, N.   +45 more
core   +5 more sources

Feasibility and Tolerability of Performing Portable MRI for Neurological Disorders in an Outpatient Neurology Clinic: A Prospective Cohort

Annals of Clinical and Translational Neurology, EarlyView.
ABSTRACT Background Accessing brain magnetic resonance imaging (MRI) can be challenging, especially for underserved patients, which may lead to disparities in neurological diagnosis. Method This mixed‐methods study enrolled adults with one of four neurological disorders: mild cognitive impairment or dementia of the Alzheimer type, multiple sclerosis ...
Maya L. Mastick, Nomin Enkhtsetseg, Joseph Sadok, Matheus Mochetti, Annabel Sorby Adams, Jennifer Guo, Cristina Trapaga Hacker, Isabella Gomez Hjerthen, Seungwon Lee, Siddharth Satish, Andrew S. Ham, Justin Hill, Denis Balaban, Kevin Kyle, Rebecca L. Gillani, Marcelo Matiello, Aleksandar Videnovic, Eric C. Klawiter, W. Taylor Kimberly, Farrah J. Mateen   +19 more
wiley   +1 more source

Multilayer stretchable electronics with designs enabling a compact lateral form

npj Flexible Electronics
Stretchable electronics are of huge interest as they can be useful in various irregular non-planar or deformable surfaces including human bodies. High density multi-functional stretchable electronics are beneficial as they can be reliably used in more ...
Dongwuk Jung, Hunpyo Ju, Sungbum Cho, Taeyeon Lee, Changeui Hong, Jongho Lee   +5 more
doaj   +1 more source

Zinc hybrid sintering for printed transient sensors and wireless electronics

npj Flexible Electronics, 2023
Transient electronics offer a promising solution for reducing electronic waste and for use in implantable bioelectronics, yet their fabrication remains challenging.
N. Fumeaux, D. Briand
doaj   +1 more source

A Review on the Fabrication and Reliability of Three-Dimensional Integration Technologies for Microelectronic Packaging: Through-Si-via and Solder Bumping Process

Metals, 2021
With the continuous miniaturization of electronic devices and the upcoming new technologies such as Artificial Intelligence (AI), Internet of Things (IoT), fifth-generation cellular networks (5G), etc., the electronics industry is achieving high-speed ...
Do Hoon Cho, Seong Min Seo, Jang Baeg Kim, Sri Harini Rajendran, Jae Pil Jung   +4 more
doaj   +1 more source