Results 71 to 75 of about 304,192 (75)

Off the Grid: A new strategy for material-jet 3D printing with enhanced sub-droplet resolution

Additive Manufacturing Letters
Drop-on-Demand additive manufacturing could offer a facile solution for scalable on-site manufacturing. With an increasing number of functional materials available for this technology, there are growing opportunities for applications, such as electronics.
Oliver Nelson-Dummett, Geoffrey Rivers, Negar Gilani, Marco Simonelli, Christopher J. Tuck, Ricky D. Wildman, Richard J.M. Hague, Lyudmila Turyanska   +7 more
doaj  

A Flexible Skin Bionic Thermally Comfortable Wearable for Machine Learning‐Facilitated Ultrasensitive Sensing

Advanced Science
Tremendous popularity is observed for multifunctional flexible electronics with appealing applications in intelligent electronic skins, human–machine interfaces, and healthcare sensing. However, the reported sensing electronics, mostly can hardly provide
Pengju Di, Yue Yuan, Mingyue Xiao, Zhishan Xu, Yicong Liu, Chenlin Huang, Guangyuan Xu, Liqun Zhang, Pengbo Wan   +8 more
doaj   +1 more source

Superconductivity in La$_4$Ni$_3$O$_{10}$ Under Pressure [PDF]

arXiv
Recently, signature of superconductivity (SC) in the trilayer compound La$_{4}$Ni$_3$O$_{10}$ has ignited significant interest. In this study, we propose a trilayer $E_g$ orbital $t$-$J_{\parallel}$-$J_{\perp}$ model to gain insights into the superconducting behavior in this material.
arxiv  

Inch‐Scale Freestanding Single‐Crystalline BiFeO3 Membranes for Multifunctional Flexible Electronics

Advanced Electronic Materials
Flexible electronics strongly demand the integration of flexible and large‐scale multifunctional oxides. BiFeO3 is one of the most essential multifunctional oxides that could be used in memories, logics, sensors, and actuators.
Ruibin Qiu, Bin Peng, Jiaxuan Zhang, Yunting Guo, Haixia Liu, Xianlei Wang, Haowen Tang, Guohua Dong, Yanan Zhao, Zhuang‐De Jiang, Ming Liu, Zhongqiang Hu   +11 more
doaj   +1 more source

Functional metallic circuitries created by laser-activated selective electroless plating for 3D customized electronics

Materials & Design
Laser-activated selective electroless plating (LASELP) is a promising complementary manufacturing process employed in hybrid additive manufacturing (HAM) technology for the fabrication of customized 3D electronics.
Hanqiang Zhang, Peiren Wang, Zhen Chen, Xiaoyi Chen, Mingxing Jiang, Junhui Yang, Ji Li   +6 more
doaj