Results 71 to 80 of about 536,412 (348)

Laser-Guided, Self-Confined Graphitization for High-Conductivity Embedded Electronics

open access: yesResearch
Facile fabrication of highly conductive and self-encapsulated graphene electronics is in urgent demand for carbon-based integrated circuits, field effect transistors, optoelectronic devices, and flexible sensors.
Haiyang Yu   +4 more
doaj   +1 more source

Mechanochemical Synthesis and Characterization of Nanostructured ErB4 and NdB4 Rare‐Earth Tetraborides

open access: yesAdvanced Engineering Materials, Volume 27, Issue 6, March 2025.
ErB4 and NdB4 nanostructured powders are produced by mechanochemical synthesis. 5 h mechanical alloying and 4 M HCl acid leaching are used in the production. ErB4 and NdB4 powders exhibit maximum magnetization of 0.4726 emu g−1 accompanied with an antiferromagnetic‐to‐paramagnetic phase transition at about TN = 18 K and 0.132 emu g−1 with a maximum at ...
Burçak Boztemur   +5 more
wiley   +1 more source

Applications of 2D-Layered Palladium Diselenide and Its van der Waals Heterostructures in Electronics and Optoelectronics [PDF]

open access: diamond, 2021
Yanhao Wang   +15 more
openalex   +1 more source

Flexible and stretchable electronics for wearable healthcare [PDF]

open access: yes, 2014
Measuring the quality of human health and well-being is one of the key growth areas in our society. Preferably, these measurements are done as unobtrusive as possible. These sensoric devices are then to be integrated directly on the human body as a patch
Bossuyt, Frederick   +7 more
core   +2 more sources

Enhancing Corrosion Resistance and Mechanical Strength of 3D‐Printed Iron Polylactic Acid for Marine Applications via Laser Surface Texturing

open access: yesAdvanced Engineering Materials, EarlyView.
Laser surface texturing significantly improves the corrosion resistance and mechanical strength of 3D‐printed iron polylactic acid (Ir‐PLA) for marine applications. Optimal laser parameters reduce corrosion by 80% and enhance tensile strength by 25% and ductility by 15%.
Mohammad Rezayat   +6 more
wiley   +1 more source

Increasing Electrode Work Function Using a Natural Molecule

open access: yesAdvanced Materials Interfaces, 2023
Providing sustainability to organic electronics is highly demanded to reduce the negative impact of organic devices on environments and human health upon their disposal.
Kouki Akaike   +4 more
doaj   +1 more source

Harnessing Fungal Biowelding for Constructing Mycelium‐Engineered Materials

open access: yesAdvanced Engineering Materials, EarlyView.
Mycelium‐bound composites (MBCs) offer low‐carbon alternatives for construction, yet interfacial bonding remains a critical challenge. This review examines fungal biowelding as a biocompatible adhesive, elucidating mycelium‐mediated interfacial mechanisms and their role in material assembly. Strategies to optimize biowelding are discussed, highlighting
Xue Brenda Bai   +2 more
wiley   +1 more source

Direct-ink-writing of highly deformable, multi-layered electrical devices using elastomer-based dual inks

open access: yesVirtual and Physical Prototyping
The advancement of soft electronics has enabled the creation of highly deformable, multi-functional devices capable of conforming to various surfaces. However, achieving both high deformability and electrical stability suitable for target applications ...
Jung Hyun Kim   +6 more
doaj   +1 more source

Engineering superfluidity in electron-hole double layers [PDF]

open access: yesPhysical Review B, 1998
We show that band-structure effects are likely to prevent superfluidity in semiconductor electron-hole double-layer systems. We suggest the possibility that superfluidity could be realized by the application of uniaxial pressure perpendicular to the electron and hole layers.
Conti, Sergio   +2 more
openaire   +2 more sources

Laser Powder Bed Fusion of Copper–Tungsten Composites for Heat Sink Applications in High‐Power Electronics

open access: yesAdvanced Engineering Materials, EarlyView.
This article demonstrates the successful qualification of a copper–tungsten composite for laser powder bed fusion. The resulting components exhibited high density, high thermal conductivity, and reduced thermal expansion. Heat sinks with complex geometries were successfully manufactured, clearly showcasing the material's potential for additive ...
Simon Rauh   +6 more
wiley   +1 more source

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